Details

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BUY SKIIP23NAB126V1 https://www.utsource.net/itm/p/12605148.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Continuous Collector Current	IC	-	1200	-	A	At Tc = 25°C, pulse width ≤ 10 μs
Peak Collector Current	ICM	-	1800	-	A	At Tc = 25°C, pulse width ≤ 10 μs
Collector-Emitter Voltage	VCES	-	1200	-	V	At IC = 0, Tc = 25°C
Gate-Source Voltage	VGS(th)	2.5	4.5	6.5	V	Turn-on threshold voltage, IC = 10 A, Tc = 25°C
On-State Collector-Emitter Voltage	VCE(on)	-	1.8	-	V	At IC = 1200 A, VGS = 15 V, Tc = 25°C
Turn-On Delay Time	tD(on)	-	0.2	0.5	μs	At IC = 1200 A, VGS = 15 V, Tc = 25°C
Rise Time	tr	-	0.5	1.0	μs	At IC = 1200 A, VGS = 15 V, Tc = 25°C
Turn-Off Delay Time	tD(off)	-	0.2	0.5	μs	At IC = 1200 A, VGS = 15 V, Tc = 25°C
Fall Time	tf	-	0.5	1.0	μs	At IC = 1200 A, VGS = 15 V, Tc = 25°C
Total Switching Time	ts	-	1.4	2.5	μs	Sum of tD(on), tr, tD(off), tf
Junction to Case Thermal Resistance	Rth(j-c)	-	0.01	-	K/W	At IC = 1200 A, Tc = 25°C
Maximum Junction Temperature	TJ(max)	-	-	175	°C	Maximum allowable junction temperature
Storage Temperature Range	Tstg	-55	-	150	°C	Temperature range for storage and non-operating conditions

Instructions for Use:

1. Mounting and Heat Sinking:

   • Ensure proper heat sinking to maintain the junction temperature within the specified limits.
   • Use thermal paste or thermal interface material between the device and the heat sink for optimal thermal performance.

2. Gate Drive:

   • Apply a gate-source voltage (VGS) of at least 15 V to ensure reliable turn-on.
   • Ensure that the gate drive circuit can provide sufficient current to charge and discharge the gate capacitance quickly.

3. Current Limiting:

   • Use appropriate current limiting techniques to prevent exceeding the maximum continuous collector current (IC) and peak collector current (ICM).

4. Thermal Management:

   • Monitor the junction temperature (TJ) to avoid exceeding the maximum junction temperature (TJ(max)).
   • Consider derating the current if operating at high ambient temperatures.

5. Storage and Handling:

   • Store the device in a dry, cool environment within the specified storage temperature range (Tstg).
   • Handle with care to avoid mechanical damage and electrostatic discharge (ESD).

6. Testing:

   • When testing the device, use the specified test conditions to ensure accurate measurements.
   • Avoid prolonged operation at the maximum ratings to prevent premature failure.

7. Safety Precautions:

   • Always follow safety guidelines when handling high-voltage and high-current components.
   • Use appropriate personal protective equipment (PPE) and work in a well-ventilated area.

(For reference only)