Details

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BUY SN74HC02DR https://www.utsource.net/itm/p/12605385.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	2.0		6.0	V
Input Low Voltage	VI(L)	ICC = 0 渭A			1.5	V
Input High Voltage	VI(H)	ICC = 0 渭A	3.5			V
Output Low Voltage	VO(L)	IO = 4 mA			0.4	V
Output High Voltage	VO(H)	IO = -4 mA	2.4			V
Input Leakage Current	II	VIN = 0 V, VCC	-1		1	渭A
Output Leakage Current	IOZ	VO = 2.5 V	-10		10	渭A
Propagation Delay Time	tpd	VCC = 4.5 V to 5.5 V		8	22	ns
Power Consumption	ICC	f = 10 MHz		4		mA

Instructions for SN74HC02DR:

1. Power Supply Requirements:

   • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V for reliable operation.

2. Input Signal Levels:

   • Recognize that an input signal below 1.5V is considered a low logic level (VI(L)).
   • An input signal above 3.5V is recognized as a high logic level (VI(H)).

3. Output Signal Levels:

   • When sourcing current up to 4mA, the output voltage should not exceed 0.4V for a low logic level (VO(L)).
   • When sinking current up to 4mA, the output voltage should be at least 2.4V for a high logic level (VO(H)).

4. Current Handling:

   • The device can handle input leakage currents between -1渭A and 1渭A.
   • Output leakage currents should be kept within -10渭A to 10渭A when the output is floating.

5. Timing Considerations:

   • The propagation delay time (tpd) varies from 8ns to 22ns depending on the supply voltage range from 4.5V to 5.5V.

6. Power Consumption:

   • The typical power consumption is around 4mA at a frequency of 10MHz.

7. Handling and Storage:

   • Handle with care to avoid damage from electrostatic discharge (ESD).
   • Store in a dry environment away from direct sunlight and excessive heat.

8. Mounting and Usage:

   • Follow standard surface mount technology (SMT) procedures for mounting.
   • Ensure all connections are secure and correctly soldered to prevent intermittent faults.

(For reference only)