Details
BUY SIHG20N50C-E3 https://www.utsource.net/itm/p/12605512.html
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Maximum Drain-Source Voltage | VDSS | 500 | V |
| Maximum Gate-Source Voltage | VGS | 卤20 | V |
| Continuous Drain Current (TC = 25掳C) | ID | 20 | A |
| Continuous Drain Current (TC = 100掳C) | ID(TC) | 14 | A |
| Pulse Drain Current (t = 10 ms, duty cycle 1%) | Ibm | 80 | A |
| Total Power Dissipation (TC = 25掳C) | Ptot | 220 | W |
| Total Power Dissipation (TC = 100掳C) | Ptot(TC) | 160 | W |
| Junction Temperature Range | Tj | -55 to +175 | 掳C |
| Storage Temperature Range | Tstg | -55 to +175 | 掳C |
| Thermal Resistance, Junction to Case | Rth(j-c) | 0.5 | 掳C/W |
| Thermal Resistance, Junction to Ambient | Rth(j-a) | 3.0 | 掳C/W |
Instructions for Use:
Voltage Handling:
- Ensure that the drain-source voltage (VDSS) does not exceed 500V.
- The gate-source voltage (VGS) should be kept within 卤20V to avoid damage.
Current Management:
- The continuous drain current (ID) at 25掳C ambient temperature is 20A. At 100掳C, it reduces to 14A.
- For pulse applications, the maximum pulse drain current (Ibm) is 80A for a 10ms pulse with a 1% duty cycle.
Power Dissipation:
- The total power dissipation (Ptot) is 220W at 25掳C and 160W at 100掳C. Ensure adequate heat sinking to manage thermal dissipation.
Temperature Considerations:
- The junction temperature (Tj) should be maintained between -55掳C and +175掳C.
- Store the device in an environment where the temperature ranges from -55掳C to +175掳C.
Thermal Management:
- Use the thermal resistance values (Rth(j-c) and Rth(j-a)) to design effective cooling solutions. The junction-to-case thermal resistance is 0.5掳C/W, and the junction-to-ambient thermal resistance is 3.0掳C/W.
Handling and Installation:
- Handle the device with care to avoid static discharge, which can damage the gate oxide.
- Follow proper soldering techniques to ensure reliable connections without overheating the device.
Testing and Verification:
- Before deploying the device in a circuit, verify all parameters using appropriate test equipment to ensure it meets the specified ratings.
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