Details
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| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Absolute Maximum Ratings | |||||
| Operating Junction Temp. | TJ | -40 | 125 | 掳C | |
| Storage Temperature | TSTG | -65 | 150 | 掳C | |
| Power Dissipation | PD | 370 | mW | ||
| Electrical Characteristics (VREF = 2.5V, IREF = 1mA) | |||||
| Reference Voltage | VREF | 2.45 | 2.5 | 2.55 | V |
| Output Current | IO | 100 | mA | ||
| Leakage Current | IL | 1 | 渭A | ||
| Thermal Resistance | R胃JA | 215 | 掳C/W |
Instructions for Use:
Power Supply:
- Ensure the power supply voltage is within the operating range specified in the absolute maximum ratings.
- The device should not exceed the maximum power dissipation to avoid thermal damage.
Reference Voltage Configuration:
- Connect the reference pin to a stable voltage source or use it in conjunction with resistors to set the desired output voltage.
- The typical reference voltage (VREF) is 2.5V.
Output Current Handling:
- The TLV431TFTA can provide up to 100mA of output current. Ensure external components and loads do not exceed this limit.
Thermal Management:
- Monitor the junction temperature to ensure it stays within the -40掳C to 125掳C range.
- If operating near the maximum temperature, consider adding heatsinks or improving airflow around the component.
Storage and Handling:
- Store the device in environments where the temperature does not fall below -65掳C or rise above 150掳C.
- Handle with care to avoid electrostatic discharge (ESD), which can damage sensitive electronic components.
Leakage Current Consideration:
- Account for a leakage current of up to 1渭A when designing circuits to ensure accurate performance.
Thermal Resistance:
- The thermal resistance from junction to ambient (R胃JA) is 215掳C/W. Design the PCB layout and cooling solutions considering this value to manage heat effectively.
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