TLV431TFTA

TLV431TFTA

Category: IC Chips

Specifications
Details

BUY TLV431TFTA https://www.utsource.net/itm/p/12605905.html

Parameter Symbol Min Typ Max Unit
Absolute Maximum Ratings
Operating Junction Temp. TJ -40 125 °C
Storage Temperature TSTG -65 150 °C
Power Dissipation PD 370 mW
Electrical Characteristics (VREF = 2.5V, IREF = 1mA)
Reference Voltage VREF 2.45 2.5 2.55 V
Output Current IO 100 mA
Leakage Current IL 1 μA
Thermal Resistance RθJA 215 °C/W

Instructions for Use:

  1. Power Supply:

    • Ensure the power supply voltage is within the operating range specified in the absolute maximum ratings.
    • The device should not exceed the maximum power dissipation to avoid thermal damage.
  2. Reference Voltage Configuration:

    • Connect the reference pin to a stable voltage source or use it in conjunction with resistors to set the desired output voltage.
    • The typical reference voltage (VREF) is 2.5V.
  3. Output Current Handling:

    • The TLV431TFTA can provide up to 100mA of output current. Ensure external components and loads do not exceed this limit.
  4. Thermal Management:

    • Monitor the junction temperature to ensure it stays within the -40°C to 125°C range.
    • If operating near the maximum temperature, consider adding heatsinks or improving airflow around the component.
  5. Storage and Handling:

    • Store the device in environments where the temperature does not fall below -65°C or rise above 150°C.
    • Handle with care to avoid electrostatic discharge (ESD), which can damage sensitive electronic components.
  6. Leakage Current Consideration:

    • Account for a leakage current of up to 1μA when designing circuits to ensure accurate performance.
  7. Thermal Resistance:

    • The thermal resistance from junction to ambient (RθJA) is 215°C/W. Design the PCB layout and cooling solutions considering this value to manage heat effectively.
(For reference only)

View more about TLV431TFTA on main site