Details

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BUY BUK969R3-100E 118 https://www.utsource.net/itm/p/12605913.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Continuous Drain Current	ID	Tch = 25掳C	-	100	-	A
Pulse Drain Current	Ipp	Tch = 25掳C, t=1ms	-	200	-	A
Gate-Source Voltage	VGS(th)	ID = 1mA	2.0	-	4.0	V
Drain-Source On-Resistance	RDS(on)	VGS = 10V, ID = 10A	-	3.5	-	m惟
Total Power Dissipation	PD	Tch = 25掳C	-	-	100	W
Junction Temperature	TJ	-	-40	-	175	掳C
Storage Temperature	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Handling Precautions:

   • Avoid exposing the device to temperatures outside the specified operating range.
   • Use appropriate anti-static measures when handling.

2. Mounting and Assembly:

   • Ensure proper thermal management, especially if operating near maximum current or power dissipation limits.
   • Follow manufacturer guidelines for soldering profiles to prevent damage during assembly.

3. Electrical Connections:

   • Verify that the gate-source voltage (VGS) does not exceed the absolute maximum rating.
   • Keep parasitic inductances low in high-frequency applications to avoid potential oscillations.

4. Thermal Considerations:

   • For continuous operation at high currents, ensure adequate heat sinking to maintain junction temperature within safe limits.

5. Testing and Validation:

   • Before deploying in a final application, conduct thorough testing under conditions representative of actual use scenarios.

6. Storage:

   • Store in a dry, cool environment to prevent moisture-related damage.

(For reference only)