FAN7392

FAN7392

Category: IC Chips

Specifications
SKU
12605972
Details

BUY FAN7392 https://www.utsource.net/itm/p/12605972.html

Parameter Symbol Min Typical Max Unit Condition
Supply Voltage Vcc 4.5 - 20 V -
Gate Drive Current (High-side) IOH - 1.2 - A Vcc = 15V, VGS = 10V
Gate Drive Current (Low-side) IOL - -1.2 - A Vcc = 15V, VGS = 10V
Propagation Delay Time (High-to-Low) tDHL 15 - 35 ns Vcc = 15V, CL = 1000pF
Propagation Delay Time (Low-to-High) tDLH 15 - 35 ns Vcc = 15V, CL = 1000pF
Pulse Width Distortion tPWD - 3 - ns Vcc = 15V, CL = 1000pF
Dead Time tD 60 - 120 ns Vcc = 15V, CL = 1000pF
Maximum Operating Junction Temperature TJ(MAX) - - 150 °C -
Storage Temperature Range TSTG -40 - 150 °C -

Instructions for Using FAN7392:

  1. Supply Voltage (Vcc):

    • The supply voltage should be within the range of 4.5V to 20V.
    • Ensure that the power supply is stable and within the specified range to avoid damage to the device.
  2. Gate Drive Current:

    • The high-side gate drive current (IOH) is typically 1.2A when Vcc = 15V and VGS = 10V.
    • The low-side gate drive current (IOL) is typically -1.2A under the same conditions.
    • These currents ensure that the MOSFETs are driven effectively and quickly.
  3. Propagation Delay Time:

    • The propagation delay time from high to low (tDHL) and from low to high (tDLH) is typically 15ns to 35ns with Vcc = 15V and a load capacitance (CL) of 1000pF.
    • Ensure that these delays are accounted for in your timing calculations to avoid overlap and potential shoot-through.
  4. Pulse Width Distortion (tPWD):

    • The pulse width distortion is typically 3ns, which is the difference in propagation delay between the high-to-low and low-to-high transitions.
    • This parameter is important for maintaining the accuracy of the pulse width in your application.
  5. Dead Time (tD):

    • The dead time is the period during which both high-side and low-side drivers are off to prevent shoot-through.
    • The typical dead time is 60ns to 120ns, which helps in protecting the MOSFETs from cross-conduction.
  6. Temperature Considerations:

    • The maximum operating junction temperature (TJ(MAX)) is 150°C.
    • The storage temperature range (TSTG) is -40°C to 150°C.
    • Ensure that the device operates within these temperature limits to avoid thermal damage.
  7. Layout and PCB Design:

    • Use short and wide traces for the gate drive signals to minimize inductance and ensure fast switching.
    • Place decoupling capacitors close to the power pins to provide stable power and reduce noise.
  8. Testing and Debugging:

    • Use an oscilloscope to monitor the gate drive signals and output waveforms to ensure proper operation.
    • Check for any signs of overheating or abnormal behavior during testing.

By following these instructions, you can ensure reliable and efficient operation of the FAN7392 in your design.

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