TF8N80

TF8N80


Specifications
SKU
12605974
Details

BUY TF8N80 https://www.utsource.net/itm/p/12605974.html

Parameter Symbol Min Typical Max Unit Description
Drain-Source Voltage VDS - 800 - V Maximum voltage between drain and source with the gate open.
Gate-Source Voltage VGS -20 - 20 V Maximum voltage between gate and source.
Continuous Drain Current ID - 8.0 - A Continuous current flowing from drain to source.
Pulse Drain Current ID(peak) - 32.0 - A Peak pulse current flowing from drain to source (tp = 10 渭s, duty cycle = 1%).
Total Power Dissipation PTOT - 150 - W Maximum power dissipation at TC = 25掳C.
Junction Temperature TJ - - 175 掳C Maximum junction temperature.
Storage Temperature Range TSTG -55 - 150 掳C Temperature range for storage and operation.
Thermal Resistance, Junction to Case R胃JC - 1.5 - 掳C/W Thermal resistance from junction to case.
Input Capacitance Ciss - 1650 - pF Input capacitance at VDS = 400V, VGS = 0V, f = 1 MHz.
Output Capacitance Coss - 490 - pF Output capacitance at VDS = 400V, VGS = 0V, f = 1 MHz.
Reverse Transfer Capacitance Crss - 130 - pF Reverse transfer capacitance at VDS = 400V, VGS = 0V, f = 1 MHz.
Turn-On Delay Time td(on) - 40 - ns Time from 10% of VGS to 10% of ID.
Rise Time tr - 60 - ns Time from 10% to 90% of ID.
Turn-Off Delay Time td(off) - 40 - ns Time from 90% of VGS to 90% of ID.
Fall Time tf - 60 - ns Time from 90% to 10% of ID.

Instructions for Use:

  1. Handling Precautions:

    • Handle the TF8N80 with care to avoid damage to the device.
    • Use proper ESD (Electrostatic Discharge) protection when handling the device.
  2. Mounting:

    • Ensure proper thermal management by using a heatsink if necessary.
    • Follow the recommended PCB layout guidelines to minimize parasitic inductances and ensure good thermal performance.
  3. Biasing:

    • Apply the gate-source voltage (VGS) within the specified limits to avoid damaging the device.
    • Use appropriate gate drive circuits to ensure fast and reliable switching.
  4. Operating Conditions:

    • Do not exceed the maximum ratings for VDS, ID, and TJ.
    • Monitor the junction temperature to ensure it remains within safe operating limits.
  5. Testing:

    • Use the specified test conditions for accurate parameter measurements.
    • Refer to the datasheet for detailed test circuits and procedures.
  6. Storage:

    • Store the device in a dry, cool environment within the specified storage temperature range.
    • Avoid exposure to high humidity and corrosive environments.
  7. Applications:

    • The TF8N80 is suitable for a wide range of high-voltage, high-current applications such as power supplies, motor control, and industrial electronics.
(For reference only)

View more about TF8N80 on main site