Details

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BUY HEF40098BT,653 https://www.utsource.net/itm/p/12606009.html

Parameter	Value/Description
Part Number	HEF40098BT,653
Function	12-Bit Shift Register with Output Latch
Supply Voltage (Vcc)	3V to 15V
Input Voltage (VIH)	0.7 * Vcc to Vcc
Input Voltage (VIL)	0V to 0.3 * Vcc
Output Voltage (VOH)	Vcc - 1.5V
Output Voltage (VOL)	0.4V
Input Current (IIH)	-1μA (max)
Input Current (IIL)	1μA (max)
Output Current (IOH)	-250μA (min)
Output Current (IOL)	250μA (min)
Propagation Delay Time	50ns (typical at Vcc = 10V)
Power Dissipation	100mW (max)
Operating Temperature	-40°C to +85°C
Storage Temperature	-65°C to +150°C
Package	DIP-16 or SOIC-16

Instructions for Use:

1. Power Supply:

   • Connect the Vcc pin to the positive supply voltage (3V to 15V).
   • Connect the GND pin to the ground.

2. Data Input:

   • Apply the serial data input to the SI (Serial In) pin.
   • The data will be shifted into the register on each clock pulse applied to the CLK pin.

3. Clock Signal:

   • Apply a clock signal to the CLK pin to shift data through the register.
   • Ensure the clock frequency is within the operating range to avoid timing issues.

4. Output Latch:

   • The latch enable (LE) pin controls when the data from the shift register is transferred to the output latches.
   • Set LE high to transfer data from the shift register to the output latches.
   • Set LE low to hold the current state of the output latches.

5. Output Enable:

   • The output enable (OE) pin controls whether the outputs are active or in a high-impedance state.
   • Set OE low to enable the outputs.
   • Set OE high to disable the outputs (high-impedance).

6. Clear Function:

   • The clear (CLR) pin can be used to reset the shift register and output latches.
   • Set CLR low to reset the device.
   • Set CLR high to allow normal operation.

7. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Store the device in a dry, cool environment to prevent moisture damage.

8. Mounting:

   • Ensure proper alignment and soldering of the device to the PCB.
   • Follow recommended soldering profiles to avoid thermal stress.

9. Testing:

   • Verify the functionality of the device by applying known input patterns and checking the corresponding outputs.
   • Use a logic analyzer or oscilloscope to monitor the signals for correct operation.

10. Documentation:

    • Refer to the datasheet for detailed electrical characteristics and timing diagrams.
    • Consult application notes for specific use cases and design considerations.

(For reference only)