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Below is the parameter table and instructions for the BD6483GUL-E2, a 1.5A Step-Down DC/DC Converter from ROHM.

Parameter Table

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Input Voltage	VIN	2.7	-	5.5	V
Output Voltage	VOUT	0.8	-	3.6	V	Set by external resistors
Output Current	IOUT	-	1.5	-	A
Quiescent Current	IQ	-	20	-	渭A	No load, VOUT = 3.3V
Dropout Voltage	VD	-	200	-	mV	IOUT = 1.5A
Switching Frequency	fSW	2.2	-	2.8	MHz
Efficiency (at 3.3V output)	畏	-	92	-	%	VIN = 5V, IOUT = 1.5A
Operating Temperature Range	Toperating	-40	-	85	掳C
Storage Temperature Range	Tstorage	-40	-	125	掳C
Package	-	-	-	-	HSO8-2EP

Instructions

1. Input Capacitor (CIN):

   • Use a ceramic capacitor with a minimum capacitance of 10 渭F and a rated voltage of at least 6.3V.
   • Place the capacitor as close as possible to the input pins (VIN and GND) to minimize noise and ensure stable operation.

2. Output Capacitor (COUT):

   • Use a ceramic capacitor with a minimum capacitance of 10 渭F and a rated voltage of at least 6.3V.
   • For better transient response, a larger capacitance (e.g., 22 渭F or 47 渭F) can be used.
   • Place the capacitor as close as possible to the output pins (VOUT and GND).

3. Inductor (L):

   • Select an inductor with a value between 1.0 渭H and 4.7 渭H.
   • Ensure the inductor has a saturation current rating higher than the maximum output current (1.5A).
   • Use a shielded inductor to reduce electromagnetic interference (EMI).

4. Feedback Resistors (R1 and R2):

   • The output voltage (VOUT) is set by the ratio of the feedback resistors (R1 and R2).
   • Use the following formula to calculate the resistor values: [ V_ = 0.8 times left(1 + fracright) ]
   • Example: For VOUT = 3.3V, R1 = 15 k惟 and R2 = 4.7 k惟.

5. Soft-Start Capacitor (CSS):

   • Connect a capacitor between the SS pin and GND to control the soft-start time.
   • The soft-start time (tSS) can be calculated using: [ t_ approx 1.1 times C_ times 10^6 text{ 渭s} ]
   • Example: For a soft-start time of 1 ms, use CSS = 100 pF.

6. Thermal Considerations:

   • Ensure adequate heat dissipation by providing a good thermal path to the PCB.
   • Use a thermal pad on the bottom of the package if available, and connect it to a large copper area on the PCB.

7. Layout Guidelines:

   • Keep the power loop (VIN to L to VOUT) as short as possible to minimize inductance and EMI.
   • Use wide traces for power lines to reduce resistance and heat generation.
   • Place bypass capacitors close to the IC to filter out high-frequency noise.

8. Protection Features:

   • The BD6483GUL-E2 includes overcurrent protection (OCP), overvoltage protection (OVP), and thermal shutdown (TSD) to ensure safe operation.
   • Do not exceed the maximum ratings specified in the datasheet to avoid damage to the device.

By following these guidelines, you can ensure optimal performance and reliability of the BD6483GUL-E2 in your application.

(For reference only)