Details

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Below is the parameter table and instructions for the YMU792-PZE7.

Parameter Table

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	Vcc	2.7	-	5.5	V
Operating Current	Iop	-	10	-	mA
Standby Current	Isb	-	0.1	-	μA
Output Frequency Range	fO	30	-	80	kHz
Frequency Stability	Δf/f	-	±50	-	ppm
Load Capacitance	CL	12	-	22	pF
Operating Temperature	Temp	-40	-	85	°C
Storage Temperature	Tstg	-55	-	125	°C
Package Size	L x W	3.2	x	2.5	mm

Instructions

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Operating Current (Iop):

   • The typical operating current is 10mA. Ensure your power supply can provide this current without dropping below the minimum voltage.

3. Standby Current (Isb):

   • In standby mode, the current consumption is typically 0.1μA. This is useful for low-power applications.

4. Output Frequency Range (fO):

   • The output frequency can be set between 30kHz and 80kHz. Refer to the datasheet for specific frequency settings and configurations.

5. Frequency Stability (Δf/f):

   • The frequency stability is ±50ppm. This ensures consistent performance over time and temperature variations.

6. Load Capacitance (CL):

   • The load capacitance should be between 12pF and 22pF. Adjust the external capacitors accordingly to match the desired load capacitance.

7. Operating Temperature (Temp):

   • The device operates reliably between -40°C and 85°C. Avoid exposing it to temperatures outside this range to prevent damage or reduced performance.

8. Storage Temperature (Tstg):

   • Store the device between -55°C and 125°C to ensure long-term reliability.

9. Package Size (L x W):

   • The package size is 3.2mm x 2.5mm. Ensure there is sufficient space on your PCB for proper mounting.

Additional Notes:

• Soldering:
  • Use a temperature-controlled soldering iron and follow standard reflow soldering profiles to avoid thermal stress.
• Handling:
  • Handle the component with care to avoid mechanical damage.
• Testing:
  • After assembly, test the device under specified operating conditions to ensure it meets the required specifications.

If you have any specific questions or need further details, refer to the full datasheet provided by the manufacturer.

(For reference only)