Details
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| Parameter | Description | Value |
|---|---|---|
| Device Type | Flash Memory | 16M-Bit (2M x 8) |
| Package | Plastic Fine Pitch Ball Grid Array (FBGA) | - |
| Operating Voltage (Vcc) | Supply Voltage | 3.0V to 3.6V |
| Access Time (tAA) | Active to Active Command Cycle Time | 70ns (max) |
| Data Retention | Minimum Data Retention Period | 20 years |
| Endurance | Typical Program/Erase Cycles | 100,000 cycles |
| Operating Temperature Range | Industrial | -40掳C to +85掳C |
| Storage Temperature Range | Storage | -65掳C to +95掳C |
| Organization | Internal Organization | 2M x 8 bits |
| Command Set | Command Compatibility | JEDEC Standard |
Instructions:
Power Supply Requirements:
- Ensure the supply voltage (Vcc) is within the range of 3.0V to 3.6V for proper operation.
Operating Conditions:
- The device operates reliably within an industrial temperature range from -40掳C to +85掳C.
- For long-term storage, keep the device within a temperature range of -65掳C to +95掳C.
Data Management:
- The memory retains data for a minimum of 20 years under specified conditions.
- The device supports up to 100,000 program/erase cycles.
Access Time:
- Ensure that the active to active command cycle time does not exceed 70ns for optimal performance.
Installation and Handling:
- Handle with care during installation to avoid damage to the FBGA package.
- Follow standard anti-static precautions when handling the device.
Command Set:
- Use JEDEC standard commands for interfacing with the device.
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