Details

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BUY KM416C256BJ-6 https://www.utsource.net/itm/p/12606223.html

Parameter	Description	Value
Device Type	High-Speed CMOS Static RAM
Part Number	KM416C256BJ-6
Organization	256K x 16 bits (4Mbits)
Supply Voltage (VCC)	Operating Range	4.5V to 5.5V
Access Time (tAC)	Access Time	60 ns (max)
Cycle Time (tCYC)	Cycle Time	60 ns (min)
Output Enable (OE#)	Active Low
Write Enable (WE#)	Active Low
Chip Select (CS#)	Active Low
Data Retention	Data Retention Time	20 years
Operating Temperature	Industrial Temperature Range	-40掳C to +85掳C
Storage Temperature	Storage Temperature Range	-65掳C to +150掳C
Package Type	Plastic Dual In-Line Package (PDIP), Ceramic DIP
Pin Count	28 pins
Standby Current	Standby Current (VCC = 5V, CS# = High)	10 渭A (max)
Active Current	Active Current (VCC = 5V, Reading/Writing)	35 mA (max)

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
   • Connect VCC to the positive power supply and GND to the ground.

2. Signal Timing:

   • The access time (tAC) is 60 ns maximum, and the cycle time (tCYC) is 60 ns minimum.
   • Ensure that the signals meet these timing requirements to avoid data corruption.

3. Control Signals:

   • OE# (Output Enable): Set to low to enable data output.
   • WE# (Write Enable): Set to low to write data to the memory.
   • CS# (Chip Select): Set to low to select the chip for operation. When high, the chip is in standby mode.

4. Data Retention:

   • The device retains data for up to 20 years under normal operating conditions.

5. Temperature Considerations:

   • Operate the device within the industrial temperature range of -40掳C to +85掳C.
   • Store the device within the storage temperature range of -65掳C to +150掳C.

6. Current Consumption:

   • The standby current is 10 渭A maximum when CS# is high.
   • The active current is 35 mA maximum during read or write operations.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

8. Mounting:

   • Mount the device on a suitable PCB with appropriate heat dissipation if necessary.
   • Ensure all connections are secure and free from solder bridges or shorts.

By following these instructions, you can ensure reliable operation and long-term performance of the KM416C256BJ-6 memory device.

(For reference only)