Details

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BUY 75337S https://www.utsource.net/itm/p/12606291.html

Parameter	Symbol	Min	Typical	Max	Unit	Description
Supply Voltage	Vcc	4.5		5.5	V	Operating supply voltage range
Output Current per Pin	Iout		20		mA	Maximum continuous output current per pin
Quiescent Current	IQ		10		渭A	Current consumed by the device when no load is applied
Operating Temperature	Topr	-40		85	掳C	Range of temperatures for normal operation
Storage Temperature	Tstg	-65		150	掳C	Range of temperatures for storage
Output Low Voltage	VOL	0.4		0.9	V	Voltage at output pin when driven low
Output High Voltage	VOH	4.4		5.0	V	Voltage at output pin when driven high
Input Voltage (High)	VIH	3.5		5.5	V	Minimum input voltage to register as high
Input Voltage (Low)	VIL	0		1.5	V	Maximum input voltage to register as low
Propagation Delay Time	tpd		10		ns	Time delay between input and output
Power Dissipation	PD			150	mW	Maximum power dissipation

Instructions for Using 75337S

1. Supply Voltage:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V to avoid damage to the device.

2. Output Current:

   • Do not exceed the maximum output current of 20mA per pin to prevent overheating and potential failure.

3. Operating Temperature:

   • The device should be operated within the temperature range of -40掳C to 85掳C to ensure reliable performance.

4. Storage Temperature:

   • When storing the device, keep it within the temperature range of -65掳C to 150掳C to avoid degradation.

5. Output Voltage Levels:

   • Ensure that the output voltages (VOL and VOH) meet the required levels for your application to avoid signal integrity issues.

6. Input Voltage Levels:

   • Verify that the input voltages (VIH and VIL) are within the specified ranges to ensure proper logic level recognition.

7. Propagation Delay:

   • Account for the propagation delay time (tpd) in your timing calculations to ensure proper synchronization of signals.

8. Power Dissipation:

   • Manage the power dissipation (PD) to stay below the maximum limit of 150mW to prevent overheating and potential damage.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.

10. Mounting:

    • Follow recommended soldering and mounting procedures to ensure proper connection and thermal management.

(For reference only)