Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.0 | - | 5.5 | V | |
| Input Low Voltage | VIL | 0.0 | - | 0.8 | V | |
| Input High Voltage | VIH | 2.0 | - | VCC | V | |
| Output Low Voltage | VOL | 0.0 | 0.1 | 0.4 | V | @ IOL = 16 mA |
| Output High Voltage | VOH | 2.4 | 2.7 | VCC - 0.4 | V | @ IOH = -4 mA |
| Input Leakage Current | IIL | -1 | - | 1 | 渭A | |
| Output Leakage Current | IOL | -1 | - | 1 | 渭A | |
| Propagation Delay Time (Low to High) | tPLH | - | 3.5 | - | ns | @ VCC = 5V, TA = 25掳C |
| Propagation Delay Time (High to Low) | tPHL | - | 3.5 | - | ns | @ VCC = 5V, TA = 25掳C |
| Power Dissipation | PD | - | - | 100 | mW | |
| Operating Temperature Range | TA | -40 | - | 85 | 掳C | |
| Storage Temperature Range | TSTG | -65 | - | 150 | 掳C |
Instructions for Use:
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 2.0V to 5.5V.
- Avoid exceeding the maximum supply voltage to prevent damage to the device.
Input Voltage Levels:
- Input low voltage (VIL) should be between 0.0V and 0.8V.
- Input high voltage (VIH) should be between 2.0V and VCC.
Output Voltage Levels:
- Output low voltage (VOL) should not exceed 0.4V when sourcing 16mA.
- Output high voltage (VOH) should be at least 2.4V and no more than VCC - 0.4V when sinking -4mA.
Leakage Currents:
- Ensure that input and output leakage currents do not exceed 卤1渭A to maintain proper operation.
Propagation Delay:
- The propagation delay times (tPLH and tPHL) are typically 3.5ns at VCC = 5V and TA = 25掳C.
Power Dissipation:
- The maximum power dissipation is 100mW. Ensure adequate heat dissipation if operating near this limit.
Temperature Ranges:
- The operating temperature range is from -40掳C to 85掳C.
- The storage temperature range is from -65掳C to 150掳C.
Handling and Storage:
- Store the device in a dry, cool environment to avoid moisture damage.
- Handle with care to prevent static discharge, which can damage the device.
Soldering:
- Use appropriate soldering techniques and temperatures to avoid thermal stress on the device.
Testing:
- Perform initial testing at room temperature and nominal supply voltage to ensure proper functionality before deploying in a final application.
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