GD32F103CBT6

GD32F103CBT6


Specifications
Details

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Parameter Description
Microcontroller Series GD32F103CBT6
Core ARM Cortex-M3
Frequency Up to 72 MHz
Flash Memory 128 KB
SRAM 32 KB
Voltage (VDD) 2.0 V to 3.6 V
Temperature Range -40掳C to +85掳C
Package LQFP48
I/O Pins 37 I/O pins
ADC Channels 12-bit, up to 16 channels
DAC Channels 12-bit, 2 channels
Timers 9 timers (basic, general-purpose, advanced-control)
Communication Interfaces USB, CAN, I2C, SPI, USART
DMA Channels 7 channels
Watchdog Timers Independent and window watchdogs
Clock Sources Internal/external oscillators, PLL

Instructions for Use:

  1. Power Supply: Ensure the power supply voltage is within the specified range of 2.0 V to 3.6 V.
  2. Clock Configuration: Configure the internal or external clock sources as needed. Utilize the Phase-Locked Loop (PLL) for higher frequency requirements.
  3. Pin Configuration: Set up I/O pins according to your application needs using the provided registers or development tools.
  4. Peripheral Initialization: Initialize peripherals such as ADC, DAC, timers, and communication interfaces using the library functions or direct register manipulation.
  5. Interrupt Handling: Implement interrupt handlers for timely response to events like timer overflows or communication data reception.
  6. Debugging: Use JTAG or SWD interfaces for debugging purposes.
  7. Programming: Program the flash memory using standard programming tools compatible with ARM Cortex-M3 devices.
  8. Operating Environment: Operate the device within the temperature range of -40掳C to +85掳C for reliable performance.

For detailed information, refer to the official datasheet and reference manual provided by GigaDevice Semiconductor Inc.

(For reference only)

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