Details
BUY MD4311BE https://www.utsource.net/itm/p/12606363.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.7 | - | 5.5 | V | Operating supply voltage range |
| Quiescent Current | IQ | - | 20 | 30 | 渭A | Current consumption in standby mode |
| Output Current | IO | 0 | 100 | 150 | mA | Maximum continuous output current |
| Output Voltage Drop | VDROP | - | 0.2 | 0.4 | V | Voltage drop across the output when loaded |
| Thermal Shutdown Temperature | TSHDN | - | 150 | 160 | 掳C | Temperature at which the device shuts down |
| Operating Temperature | TA | -40 | - | 85 | 掳C | Ambient operating temperature range |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C | Temperature range for storage |
Instructions:
Power Supply Connection:
- Connect the positive terminal of the power supply to the VCC pin.
- Connect the ground (GND) pin to the negative terminal of the power supply.
Output Connection:
- Connect the load to the output (OUT) pin.
- Ensure the load does not exceed the maximum output current (IO) to avoid damage.
Thermal Management:
- Ensure adequate heat dissipation, especially when operating at high output currents or in high ambient temperatures.
- If the device reaches the thermal shutdown temperature (TSHDN), it will automatically shut down to prevent damage.
Operating Environment:
- Operate the device within the specified ambient temperature range (TA) to ensure reliable performance.
- Store the device within the specified storage temperature range (TSTG) to prevent degradation.
Quiescent Current:
- The device has a low quiescent current (IQ), making it suitable for battery-powered applications where power efficiency is critical.
Voltage Drop:
- The output voltage drop (VDROP) should be considered when designing the circuit to ensure the output voltage remains within acceptable limits under load.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow proper soldering techniques to avoid thermal stress during assembly.
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