Details

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BUY IXRFD630 https://www.utsource.net/itm/p/12606445.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	VIN	4.5	-	28	V	Operating input voltage range
Output Voltage	VOUT	-	3.3	-	V	Nominal output voltage
Output Current	IOUT	-	-	3	A	Maximum continuous output current
Efficiency	畏	-	90	-	%	Typical efficiency at full load
Switching Frequency	fSW	-	600	-	kHz	Typical switching frequency
Quiescent Current	IQ	-	10	-	渭A	Quiescent current at no load
Dropout Voltage	VDO	-	1.2	-	V	Typical dropout voltage
Thermal Shutdown	TSD	-	160	-	掳C	Temperature at which thermal shutdown occurs
Operating Temperature	TA	-40	-	125	掳C	Ambient operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range

Instructions for Use

1. Input Voltage (V_IN):

   • Ensure the input voltage is within the specified range of 4.5V to 28V.
   • Avoid exceeding the maximum input voltage to prevent damage to the device.

2. Output Voltage (V_OUT):

   • The nominal output voltage is 3.3V. If a different output voltage is required, adjust the external feedback resistor network accordingly.

3. Output Current (I_OUT):

   • The device can provide up to 3A of continuous output current. For higher currents, consider using additional heat sinking or a more powerful device.

4. Efficiency (畏):

   • The typical efficiency is 90% at full load. Monitor the efficiency under actual operating conditions to ensure optimal performance.

5. Switching Frequency (f_SW):

   • The typical switching frequency is 600kHz. This can be adjusted by modifying the external components if necessary.

6. Quiescent Current (I_Q):

   • The quiescent current is typically 10渭A. This low current draw helps minimize power consumption when the device is not actively supplying load current.

7. Dropout Voltage (V_DO):

   • The typical dropout voltage is 1.2V. This is the minimum difference between the input and output voltages required for the regulator to maintain regulation.

8. Thermal Shutdown (T_SD):

   • The device will shut down if the internal temperature exceeds 160掳C to prevent thermal damage. Ensure adequate cooling, especially under high load conditions.

9. Operating Temperature (T_A):

   • The device can operate in ambient temperatures ranging from -40掳C to 125掳C. Ensure that the device is not exposed to temperatures outside this range.

10. Storage Temperature (T_STG):

    • Store the device in temperatures ranging from -65掳C to 150掳C to ensure long-term reliability.

Additional Notes:

• Always refer to the datasheet for detailed specifications and application notes.
• Proper PCB layout and component selection are crucial for optimal performance and reliability.

(For reference only)