Details
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| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCE | - | - | 300 | V |
| Emitter-Base Voltage | VEB | -6 | - | 6 | V |
| Collector-Base Voltage | VCB | - | - | 300 | V |
| Collector Current | IC | - | 500 | 1000 | mA |
| Base Current | IB | - | - | 100 | mA |
| Power Dissipation | PT | - | - | 625 | mW |
| Junction Temperature | TJ | -55 | - | 150 | 掳C |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C |
Instructions for Use:
Handling Precautions:
- Avoid exceeding the maximum ratings listed in the parameter table.
- Handle the device with care to prevent damage from static electricity.
Mounting:
- Ensure proper heat sinking if operating near the maximum power dissipation.
- Use appropriate mounting techniques to avoid mechanical stress on the leads.
Biasing:
- Apply base current (IB) to control the collector current (IC).
- Ensure the base-emitter voltage (VEB) is within the specified limits.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it does not exceed 150掳C.
- Consider using a heatsink if continuous high power operation is required.
Storage:
- Store the device in a dry, cool environment within the storage temperature range (-65掳C to 150掳C).
Testing:
- Perform initial testing at room temperature and gradually increase power levels while monitoring performance and temperature.
Soldering:
- Use a controlled soldering process to avoid overheating the device.
- Follow recommended soldering profiles to ensure reliable connections.
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