TGPF30N40P

TGPF30N40P


Specifications
Details

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Parameter Symbol Min Typical Max Unit Conditions
Drain-Source On-State Resistance RDS(on) - 0.24 - VGS = 10V, ID = 10A
Gate-Source Threshold Voltage VGS(th) 2.0 - 4.0 V ID = 250渭A
Continuous Drain Current ID - - 30 A TC = 25掳C
Pulse Drain Current IGM - - 90 A tp = 10ms, TC = 25掳C
Power Dissipation PD - - 170 W TC = 25掳C
Junction Temperature TJ - - 175 掳C -
Storage Temperature TSTG -55 - 150 掳C -

Instructions for TGPF30N40P:

  1. Installation:

    • Ensure the device is handled with care to avoid damage from electrostatic discharge (ESD).
    • Use appropriate heat sinks or cooling solutions if operating near maximum power dissipation.
  2. Operating Conditions:

    • Do not exceed the maximum ratings listed in the table.
    • Maintain the junction temperature within specified limits to ensure reliable operation.
  3. Gate Drive:

    • Apply a gate-source voltage (VGS) of at least 10V to fully turn on the device and minimize on-state resistance.
    • Avoid applying voltages outside the threshold range to prevent unintended operation.
  4. Handling Pulses:

    • For pulse operations, ensure the pulse duration does not exceed the specified limits to prevent thermal overload.
  5. Storage:

    • Store the device in a dry, cool environment within the storage temperature range to prevent degradation.
  6. Safety Precautions:

    • Always follow safe handling practices and consult the datasheet for detailed specifications and safety guidelines.
(For reference only)

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