Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Condition |
|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCE | - | 650 | - | V | |
| Gate-Source Voltage | VGS | -20 | - | 15 | V | |
| Continuous Collector Current | IC | - | 50 | - | A | TC = 25掳C |
| Continuous Collector Current (TC = 100掳C) | IC(TC) | - | 37.5 | - | A | TC = 100掳C |
| Pulse Collector Current | ICmax | - | 150 | - | A | tp = 10 渭s, IG = 10 A |
| Total Power Dissipation | PT | - | 400 | - | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 150 | 掳C | |
| Storage Temperature Range | TSTG | -55 | - | 150 | 掳C |
Instructions for Use:
Voltage Ratings:
- Ensure that the collector-emitter voltage (VCE) does not exceed 650V.
- The gate-source voltage (VGS) should be kept between -20V and +15V to avoid damage.
Current Ratings:
- The continuous collector current (IC) is rated at 50A at a case temperature (TC) of 25掳C. This reduces to 37.5A at TC = 100掳C.
- For pulse conditions, the maximum collector current (ICmax) can reach 150A for a pulse duration of 10 渭s with a gate current (IG) of 10A.
Power Dissipation:
- The total power dissipation (PT) should not exceed 400W at a case temperature of 25掳C.
Temperature Considerations:
- The junction temperature (TJ) should not exceed 150掳C.
- Store the device within the temperature range of -55掳C to 150掳C.
Handling and Mounting:
- Handle the device with care to avoid mechanical stress.
- Ensure proper heat sinking to manage thermal dissipation effectively.
Gate Drive:
- Use appropriate gate drive circuits to ensure reliable operation. Avoid excessive gate current which can lead to damage.
Testing:
- Test the device under controlled conditions to ensure it meets the specified parameters before integrating it into a circuit.
Compliance:
- Ensure compliance with all relevant safety and regulatory standards when using this device in your application.
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