Details

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BUY AD7401AYR https://www.utsource.net/itm/p/12606604.html

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	VDD	2.7	-	5.25	V
Supply Current (Active)	IDD	-	1.6	-	mA
Supply Current (Shutdown)	IDD_SHDN	-	0.5	-	渭A
Input Voltage Range	VIN	0	-	VDD	V
Output Voltage Range	VOUT	0	-	VDD	V
Differential Input Impedance	Zin	-	1 M	-	惟
Common-Mode Input Impedance	Zcm	-	100 k	-	惟
Output Impedance	Zout	-	100	-	惟
Bandwidth	fBW	-	200	-	kHz
Signal-to-Noise Ratio	SNR	-	85	-	dB
Total Harmonic Distortion	THD	-	-90	-	dB
Power-Down Time	tPD	-	1.5	-	渭s
Wake-Up Time	tWU	-	1.5	-	渭s
Operating Temperature	Toper	-40	-	125	掳C
Storage Temperature	Tstg	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Connect the VDD pin to a power supply within the range of 2.7V to 5.25V.
   • Ensure the power supply is stable and has adequate filtering to minimize noise.

2. Ground Connection:

   • Connect the GND pin to the system ground.

3. Input Signal:

   • Apply the input signal to the VIN pin. The input voltage should be within the range of 0V to VDD.
   • Ensure the input signal is within the differential and common-mode input impedance specifications.

4. Output Signal:

   • The output signal will be available on the VOUT pin.
   • The output voltage range is from 0V to VDD.

5. Power-Down Mode:

   • To enter power-down mode, set the SHDN pin to a high level.
   • The device will consume less current in this mode, typically around 0.5 渭A.

6. Wake-Up from Power-Down:

   • To wake up the device from power-down mode, set the SHDN pin to a low level.
   • The device will take approximately 1.5 渭s to become fully operational.

7. Temperature Considerations:

   • The device is designed to operate within the temperature range of -40掳C to 125掳C.
   • Store the device in an environment with temperatures between -65掳C and 150掳C.

8. Layout and PCB Design:

   • Use proper PCB layout techniques to minimize noise and ensure reliable operation.
   • Place bypass capacitors close to the VDD and GND pins to filter out high-frequency noise.

9. Handling and Storage:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Store the device in a dry and cool environment to prevent moisture damage.

(For reference only)