Details

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BUY LM710CN https://www.utsource.net/itm/p/12606628.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Input Voltage	VIN	Continuous operation	2.0	-	40.0	V
Output Voltage	VOUT	No load to full load	1.23	-	-	V
Output Current	IOUT	Continuous operation	-	100	-	mA
Quiescent Current	IQ	VIN = 5V, no load	-	50	-	渭A
Dropout Voltage	VDROP	IOUT = 100mA	-	1.0	-	V
Load Regulation	-	0 to 100mA	-	0.01	-	%
Line Regulation	-	2.0V to 40.0V	-	0.01	-	%
Temperature Coefficient	-	-40掳C to 85掳C	-	50	-	ppm/掳C
Operating Temperature	TOP	-	-40	-	85	掳C
Storage Temperature	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the input voltage (V_IN) is within the range of 2.0V to 40.0V.
   • Use a suitable decoupling capacitor (typically 0.1渭F) close to the input pin to filter out noise.

2. Output Configuration:

   • The output voltage (V_OUT) is fixed at 1.23V. If a different output voltage is required, use external resistors to adjust the feedback network.
   • Place a bypass capacitor (typically 10渭F) at the output to stabilize the output voltage and reduce ripple.

3. Load Regulation:

   • The load regulation is very low (0.01%), ensuring that the output voltage remains stable even when the load current changes from 0 to 100mA.

4. Line Regulation:

   • The line regulation is also very low (0.01%), maintaining output stability over the input voltage range.

5. Temperature Considerations:

   • The device operates reliably over a temperature range of -40掳C to 85掳C.
   • Store the device in an environment between -65掳C and 150掳C.

6. Quiescent Current:

   • The quiescent current is typically 50渭A, which is relatively low, making the device suitable for battery-powered applications.

7. Dropout Voltage:

   • The dropout voltage is 1.0V at full load (100mA), meaning the input voltage must be at least 1.0V higher than the output voltage to maintain regulation.

8. Thermal Management:

   • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures to prevent thermal shutdown.

9. Mounting:

   • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
   • Avoid placing the device near sources of heat or electromagnetic interference.

10. Testing:

    • Before finalizing the design, test the circuit under various conditions to ensure it meets the required specifications and performance criteria.

(For reference only)