Details

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BUY P8742AH https://www.utsource.net/itm/p/12606661.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating voltage range	2.0	-	5.5	V
Output Current (IO)	Maximum output current per channel	-	20	-	mA
Operating Temperature (TA)	Ambient temperature range	-40	-	85	掳C
Storage Temperature (TSTG)	Storage temperature range	-65	-	150	掳C
Input Voltage (VIN)	Input voltage range for logic levels	0.0	-	VCC	V
Low-Level Output Voltage (VOL)	Output voltage at low level	0.0	0.4	0.9	V
High-Level Output Voltage (VOH)	Output voltage at high level	VCC-0.4	VCC-0.1	VCC	V
Propagation Delay Time (tPLH, tPHL)	Time delay from input to output	-	10	30	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	350	mW
Quiescent Current (IQ)	Current consumption in quiescent state	-	0.1	1.0	mA

Instructions for Use:

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the range of 2.0V to 5.5V to avoid damage to the device.

2. Output Current (IO):

   • Do not exceed the maximum output current of 20mA per channel to prevent overheating and potential failure.

3. Operating Temperature (TA):

   • The device is designed to operate within an ambient temperature range of -40掳C to 85掳C. Avoid exposing the device to temperatures outside this range.

4. Storage Temperature (TSTG):

   • Store the device in an environment with temperatures between -65掳C and 150掳C to ensure long-term reliability.

5. Input Voltage (VIN):

   • The input voltage should be within the range of 0V to VCC to ensure proper logic levels are recognized.

6. Low-Level Output Voltage (VOL):

   • The output voltage at low level should be between 0V and 0.9V to ensure compatibility with other digital circuits.

7. High-Level Output Voltage (VOH):

   • The output voltage at high level should be between VCC-0.4V and VCC to ensure proper logic levels are maintained.

8. Propagation Delay Time (tPLH, tPHL):

   • The propagation delay time from input to output is typically 10ns with a maximum of 30ns. This should be considered when designing timing-sensitive applications.

9. Power Dissipation (PD):

   • The maximum power dissipation is 350mW. Ensure adequate heat dissipation if the device is operating near this limit.

10. Quiescent Current (IQ):

    • The quiescent current is typically 0.1mA and can go up to 1.0mA. This should be considered in low-power applications.

Additional Notes:

• Always refer to the datasheet for the most accurate and detailed information.
• Proper PCB layout and decoupling capacitors are recommended to ensure stable operation.
• Avoid static discharge and follow ESD handling procedures to prevent damage to the device.

(For reference only)