Details

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BUY M51342P https://www.utsource.net/itm/p/12606672.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	Vcc	Operating	4.5	-	5.5	V
Quiescent Current	Iq	Vcc = 5V, No Load	-	20	-	渭A
Output Voltage	Vo	Vcc = 5V, No Load	4.8	5.0	5.2	V
Output Current	Io	Continuous	-	100	-	mA
Thermal Shutdown Temperature	Tsd	-	160	-	-	掳C
Storage Temperature	Tstg	-	-40	-	85	掳C
Junction Temperature	Tj	Maximum	-	-	150	掳C

Instructions for Use:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage or improper operation.

2. Quiescent Current (Iq):

   • The quiescent current is typically 20 渭A at 5V with no load. This is the current consumed by the device when it is not driving any external load.

3. Output Voltage (Vo):

   • The output voltage should be between 4.8V and 5.2V under no load conditions when the supply voltage is 5V.

4. Output Current (Io):

   • The maximum continuous output current is 100 mA. Do not exceed this limit to prevent overheating and potential damage.

5. Thermal Shutdown (Tsd):

   • The device will automatically shut down if the temperature exceeds 160掳C to protect against thermal damage.

6. Storage Temperature (Tstg):

   • Store the device in an environment where the temperature ranges from -40掳C to 85掳C to ensure long-term reliability.

7. Junction Temperature (Tj):

   • The maximum junction temperature is 150掳C. Ensure proper heat dissipation to keep the junction temperature within safe limits.

8. Mounting:

   • Use appropriate mounting techniques to ensure good thermal contact with the heatsink or PCB.

9. Power-On Sequence:

   • Apply the supply voltage (Vcc) before connecting any load to the output.

10. Power-Off Sequence:

    • Disconnect the load from the output before removing the supply voltage (Vcc).

11. Capacitors:

    • Use recommended input and output capacitors to stabilize the power supply and reduce noise. Typically, a 10 渭F electrolytic capacitor on the input and a 1 渭F ceramic capacitor on the output are sufficient.

12. PCB Layout:

    • Keep the layout compact and minimize trace lengths to reduce parasitic inductance and improve performance.

(For reference only)