Details

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BUY MBR20200SCT https://www.utsource.net/itm/p/12606697.html

Parameter	Symbol	Test Conditions	Min	Typ	Max	Unit
Maximum Repetitive Peak Reverse Voltage	VRRM	-	-	200	-	V
Maximum DC Blocking Voltage	VRM	-	-	200	-	V
Maximum RMS Voltage (sinusoidal)	VRMS	-	-	141	-	V
Maximum Average Rectified Forward Current (TA = 25掳C)	IF(AV)	TA = 25掳C	-	20	-	A
Maximum Average Rectified Forward Current (TA = 75掳C)	IF(AV)	TA = 75掳C	-	16	-	A
Maximum Non-repetitive Peak Surge Current	IFSM	tj = 25掳C, 10 ms single half sine-wave	-	100	-	A
Maximum Junction Temperature	TJ(max)	-	-	-	150	掳C
Storage Temperature Range	TSTG	-	-65	-	150	掳C
Operating Junction to Ambient Thermal Resistance	R胃JA	-	-	20	-	掳C/W
Forward Voltage at Rated Current	VF	IF = 20 A, TA = 25掳C	-	1.1	-	V
Reverse Recovery Time	trr	IF = 20 A, IRR = 20 A, TA = 25掳C	-	35	-	ns
Leakage Current at Maximum Reverse Voltage	IR	VRRM = 200 V, TA = 25掳C	-	100	-	渭A

Instructions for Use:

1. Mounting and Handling:

   • Handle the MBR20200SCT with care to avoid mechanical damage.
   • Ensure that the device is mounted on a heatsink if operating at high currents to maintain junction temperature within safe limits.

2. Electrical Connections:

   • Connect the device according to the polarity markings on the package.
   • Use appropriate wire gauges to handle the maximum current ratings.

3. Thermal Management:

   • Monitor the junction temperature to ensure it does not exceed 150掳C.
   • Use thermal paste between the device and heatsink to improve heat dissipation.

4. Surge Current Protection:

   • Ensure that the non-repetitive peak surge current does not exceed 100 A to prevent damage to the device.
   • Consider using additional protection circuits such as fuses or TVS diodes for transient voltage suppression.

5. Storage and Environment:

   • Store the device in a dry environment within the temperature range of -65掳C to 150掳C.
   • Avoid exposure to corrosive or humid environments.

6. Testing and Verification:

   • Verify all electrical parameters using the specified test conditions before integrating the device into a circuit.
   • Regularly inspect the device for signs of wear or damage during operation.

7. Compliance and Standards:

   • Ensure that the application complies with relevant safety and regulatory standards.
   • Refer to the datasheet for detailed information on compliance and certifications.

(For reference only)