Details

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BUY XDS-SVA https://www.utsource.net/itm/p/12606703.html

Parameter	Description	Value/Range
Part Number	Unique identifier for the component	XDS-SVA
Type	Category of the component	Voltage Supervisor
Supply Voltage (Vcc)	Operating voltage range	1.62V to 5.5V
Threshold Voltage (Vth)	Voltage level at which the output changes state	1.62V, 1.8V, 2.3V, 2.7V, 3.0V, 3.3V, 4.0V, 4.5V, 5.0V
Output Type	Type of output signal	Open Drain (OD) or Push-Pull (PP)
Output Current (Iout)	Maximum output current	10mA (OD), 50mA (PP)
Response Time (tR)	Time taken to respond to a change in input voltage	100渭s max
Operating Temperature (Toper)	Range of temperatures under which the device can operate	-40掳C to +85掳C
Package	Physical package type	SOT-23, SC70
Pin Count	Number of pins on the package	3, 5
Quiescent Current (IQ)	Current consumed by the device when active	1渭A max
Input Voltage Range (Vin)	Range of input voltages that the device can monitor	0V to Vcc
Output Low Voltage (VOL)	Voltage level at the output when low	0.4V max
Output High Voltage (VOH)	Voltage level at the output when high	Vcc - 0.4V min

Instructions for Use

1. Power Supply Connection:

   • Connect the supply voltage (Vcc) to the appropriate pin.
   • Ensure the supply voltage is within the specified range (1.62V to 5.5V).

2. Input Voltage Monitoring:

   • Connect the input voltage (Vin) to the monitoring pin.
   • The device will compare Vin to the threshold voltage (Vth).

3. Output Configuration:

   • Choose between Open Drain (OD) or Push-Pull (PP) output types based on your application.
   • For OD output, connect a pull-up resistor to Vcc.
   • For PP output, no external pull-up resistor is required.

4. Output Signal:

   • The output will go low when Vin falls below Vth.
   • The output will go high when Vin rises above Vth.

5. Temperature Considerations:

   • Ensure the operating temperature remains within the specified range (-40掳C to +85掳C).

6. Quiescent Current:

   • The device consumes a maximum of 1渭A when active, making it suitable for low-power applications.

7. Response Time:

   • The device responds to changes in input voltage within 100渭s.

8. Package Handling:

   • Handle the device with care to avoid damage to the pins and internal components.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and assembly.

9. Mounting:

   • Solder the device to the PCB using recommended soldering techniques.
   • Ensure proper alignment and orientation of the device on the PCB.

10. Testing:

    • After assembly, test the device to ensure it meets the specified performance parameters.
    • Verify the output behavior under different input voltage conditions.

(For reference only)