Details

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BUY RILP0408CSP-7LC https://www.utsource.net/itm/p/12606729.html

Parameter	Value
Part Number	RILP0408CSP-7LC
Package Type	CSP (Chip Scale Package)
Mounting Type	Surface Mount
Lead Finish	Matte Tin
Operating Temperature	-55掳C to +125掳C
Storage Temperature	-65掳C to +150掳C
Moisture Sensitivity Level (MSL)	Level 3 (168 hours)
Lead Count	7
Body Size	0.4 mm x 0.8 mm
Body Height	0.23 mm
Pitch	0.5 mm
Max Power Dissipation	120 mW
Max Operating Voltage	1.8 V
ESD Rating	HBM: 2000 V, MM: 200 V

Instructions for Handling and Storage:

1. Handling:

   • Use appropriate ESD protection equipment (e.g., wrist straps, grounded workstations).
   • Handle by the edges; avoid touching the contact areas.
   • Do not apply excessive force or torque during handling or assembly.

2. Storage:

   • Store in a dry, cool environment.
   • Follow MSL guidelines to prevent moisture damage.
   • Open packaging only when ready to use and reseal any unused components in a desiccant-filled bag.

3. Soldering:

   • Use a reflow soldering profile suitable for CSP components.
   • Preheat the board to 150掳C for 60-90 seconds.
   • Peak temperature should be 230掳C to 250掳C for 30-60 seconds.
   • Cool down naturally to room temperature.

4. Inspection:

   • Visually inspect the solder joints for proper wetting and alignment.
   • Use X-ray inspection for internal voids and solder joint quality if necessary.

5. Cleaning:

   • Use a mild cleaning solution and soft brush to remove flux residues.
   • Rinse with deionized water and dry thoroughly.

(For reference only)