Details
BUY SS413F https://www.utsource.net/itm/p/12606734.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | - | 1.2 | 1.5 | V | Voltage at IF = 20 mA |
| Reverse Current | IR | - | 100 | 500 | nA | At VR = 5 V, TA = 25°C |
| Peak Forward Current | IFM | - | - | 100 | mA | Pulse width ≤ 1 ms, duty cycle ≤ 2% |
| Operating Temperature | TOPR | -40 | - | 85 | °C | Operating temperature range |
| Storage Temperature | TSTG | -65 | - | 150 | °C | Storage temperature range |
| Reverse Breakdown Voltage | VBR | 5 | - | - | V | Minimum reverse breakdown voltage |
Instructions for Use:
Forward Voltage (VF):
- Ensure that the forward voltage applied to the diode does not exceed 1.5V when the forward current is 20mA.
Reverse Current (IR):
- The reverse current should be kept below 500nA to avoid excessive leakage when the reverse voltage is 5V at room temperature (25°C).
Peak Forward Current (IFM):
- The peak forward current should not exceed 100mA. This value is for pulses with a width of 1ms and a duty cycle of 2% or less.
Operating Temperature (TOPR):
- The device is designed to operate within a temperature range of -40°C to 85°C. Ensure that the ambient temperature does not exceed these limits during operation.
Storage Temperature (TSTG):
- Store the device in an environment where the temperature ranges from -65°C to 150°C to prevent damage.
Reverse Breakdown Voltage (VBR):
- The minimum reverse breakdown voltage is 5V. Ensure that the reverse voltage applied to the diode does not exceed this value to avoid damage.
Handling:
- Handle the device with care to avoid mechanical stress or damage to the leads.
- Use appropriate ESD (Electrostatic Discharge) protection measures to prevent damage from static electricity.
Mounting:
- Follow recommended soldering profiles to ensure reliable connections and avoid thermal shock.
- Ensure proper cooling if the device is expected to dissipate significant power during operation.
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