Details

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BUY FP50R12KT3/50A1200V https://www.utsource.net/itm/p/12606736.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Rated Voltage	VDRM	-	-	1200	V	-
Rated Current	IT(AV)	-	50	-	A	-
Forward Voltage Drop	VF	-	1.8	-	V	@ 50A, 25掳C
Reverse Recovery Time	trr	-	60	-	ns	@ IF=50A, dI/dt=200A/渭s
Junction Temperature	TJ	-55	-	175	掳C	-
Storage Temperature	TSTG	-55	-	150	掳C	-

Instructions for Use:

1. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within specified limits.
   • Use recommended torque values for screw terminals to avoid damage.

2. Operating Conditions:

   • Do not exceed the maximum rated voltage (1200V) and current (50A).
   • Ensure the device is operated within the specified temperature range (-55掳C to 175掳C).

3. Handling:

   • Handle with care to avoid mechanical stress on the device.
   • Use appropriate ESD protection to prevent damage from static electricity.

4. Testing:

   • Perform initial testing at room temperature to verify proper operation.
   • Conduct thermal tests to ensure the device does not exceed its maximum junction temperature under load.

5. Storage:

   • Store in a dry, cool place within the storage temperature range (-55掳C to 150掳C).

6. Soldering:

   • Use a soldering temperature of 260掳C for no more than 10 seconds per connection.
   • Allow the device to cool naturally after soldering to avoid thermal shock.

7. Derating:

   • For continuous operation at temperatures above 25掳C, derate the current to ensure the junction temperature remains within safe limits.

8. Reverse Recovery:

   • Be aware of the reverse recovery time (60ns) and design circuits to handle the associated transient currents.

9. Documentation:

   • Refer to the datasheet for detailed electrical characteristics and mechanical dimensions.
   • Consult application notes for specific circuit design recommendations.

(For reference only)