Details

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BUY SUP75N06-07L https://www.utsource.net/itm/p/12606749.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	60	-	V
Gate-Source Voltage	VGS	-12	0	12	V
Continuous Drain Current	ID	-	75	-	A	TC = 25掳C
Pulse Drain Current	ID(p)	-	150	-	A	tp = 10ms, TC = 25掳C
Power Dissipation	PTOT	-	130	-	W	TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C
Storage Temperature	TSTG	-55	-	150	掳C

Instructions:

1. Handling Precautions:

   • Avoid exposing the device to temperatures outside the specified range.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting and Soldering:

   • Ensure that the soldering temperature does not exceed 260掳C for more than 10 seconds.
   • Allow the device to cool down naturally after soldering to prevent thermal shock.

3. Operating Conditions:

   • Do not exceed the maximum ratings under any operating conditions.
   • Ensure adequate heat sinking to maintain the junction temperature within safe limits.

4. Testing and Verification:

   • Verify the device parameters using standard test circuits and conditions as specified in the datasheet.
   • Perform functional tests at both minimum and maximum operating temperatures to ensure reliability.

5. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Follow the recommended storage conditions to ensure long-term reliability.

6. Applications:

   • Suitable for high-power switching applications, such as motor control, power supplies, and inverters.
   • Ensure the device is used within its specified operating parameters for optimal performance.

(For reference only)