Details

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BUY D40E5 https://www.utsource.net/itm/p/12606763.html

Parameter	Description	Value
Part Number	Device Identifier	D40E5
Type	Silicon Controlled Rectifier (SCR)	-
Maximum RMS Voltage (VRRM)	Maximum repetitive peak reverse voltage that can be applied continuously	400 V
Maximum RMS On-State Current (IT(RMS))	Maximum RMS on-state current at 25掳C ambient temperature	5 A
Peak Surge Current (ITSM)	Maximum non-repetitive surge current (8.3 ms sine wave, one cycle)	100 A
Gate Trigger Current (IGT)	Minimum gate current required to turn on the SCR	50 mA
Holding Current (IH)	Minimum anode current required to maintain conduction after triggering	10 mA
Power Dissipation (PD)	Maximum power dissipation at 25掳C ambient temperature	100 W
Operating Temperature (TJ)	Junction operating temperature range	-40掳C to 125掳C
Storage Temperature (TSTG)	Storage temperature range	-65掳C to 150掳C
Case Style	Physical package type	TO-220

Instructions for Use

1. Mounting:

   • Ensure proper heat sinking to manage thermal dissipation, especially under high current conditions.
   • Use a heatsink with a thermal resistance suitable for the application to keep the junction temperature within the specified range.

2. Wiring:

   • Connect the anode (A) to the positive side of the circuit.
   • Connect the cathode (K) to the negative side of the circuit.
   • The gate (G) should be connected to the control circuit to trigger the SCR.

3. Triggering:

   • Apply a pulse of gate current (IGT) to turn on the SCR.
   • The SCR will remain on as long as the anode current (IA) is above the holding current (IH).

4. Surge Handling:

   • Ensure that the peak surge current (ITSM) does not exceed the rated value to avoid damage.
   • Use appropriate fuses or circuit breakers to protect against overcurrent conditions.

5. Thermal Management:

   • Monitor the junction temperature (TJ) to ensure it stays within the operating range.
   • If the device is expected to operate near the maximum power dissipation, consider forced air cooling or a larger heatsink.

6. Storage:

   • Store the device in a dry environment within the specified storage temperature range (TSTG).

7. Safety:

   • Handle the device with care to avoid mechanical stress.
   • Follow standard safety procedures when working with high voltages and currents.

(For reference only)