2SK416STR

2SK416STR


Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Drain-source breakdown voltage BVdss Vds = 0, Id = -1mA 450 V
Gate-source breakdown voltage BVgss Vgs = 0, Ig = 卤1mA 卤30 V
Gate threshold voltage Vth Id = -1mA -4 -2.5 -1 V
Maximum drain current Id Vds = -10V -80 mA
Transconductance Gfs Vgs = -4V, Id = -10mA 2.5 S
Input capacitance Ciss Vds = -15V, f = 1MHz 600 pF
Output capacitance Coff Vds = -15V, f = 1MHz 10 pF
Reverse transfer capacitance Crss Vds = -15V, f = 1MHz 20 pF

Instructions for Use:

  1. Biasing and Operating Voltage:

    • Ensure the gate-source voltage (Vgs) does not exceed the specified maximum of 卤30V to avoid damaging the device.
    • The drain-source voltage (Vds) should be kept below 450V to prevent breakdown.
  2. Temperature Considerations:

    • Operate within the temperature range specified by the manufacturer to ensure reliable performance and longevity.
  3. Handling Precautions:

    • Handle with care to avoid static damage; use proper ESD protection practices.
    • Avoid mechanical stress on the leads which can affect electrical characteristics.
  4. Mounting:

    • Follow recommended mounting procedures to ensure good thermal contact and electrical connections.
    • Proper heatsinking is crucial if operating at high power levels or in high ambient temperatures.
  5. Testing:

    • When testing the device, adhere to the conditions specified in the parameter table to obtain accurate measurements.
    • Use appropriate test equipment and settings to avoid overstressing the device.
  6. Storage:

    • Store in a dry, cool place away from direct sunlight and sources of heat to maintain device integrity.
(For reference only)

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