Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | BVdss | Vds = 0, Id = -1mA | 450 | V | ||
| Gate-source breakdown voltage | BVgss | Vgs = 0, Ig = 卤1mA | 卤30 | V | ||
| Gate threshold voltage | Vth | Id = -1mA | -4 | -2.5 | -1 | V |
| Maximum drain current | Id | Vds = -10V | -80 | mA | ||
| Transconductance | Gfs | Vgs = -4V, Id = -10mA | 2.5 | S | ||
| Input capacitance | Ciss | Vds = -15V, f = 1MHz | 600 | pF | ||
| Output capacitance | Coff | Vds = -15V, f = 1MHz | 10 | pF | ||
| Reverse transfer capacitance | Crss | Vds = -15V, f = 1MHz | 20 | pF |
Instructions for Use:
Biasing and Operating Voltage:
- Ensure the gate-source voltage (Vgs) does not exceed the specified maximum of 卤30V to avoid damaging the device.
- The drain-source voltage (Vds) should be kept below 450V to prevent breakdown.
Temperature Considerations:
- Operate within the temperature range specified by the manufacturer to ensure reliable performance and longevity.
Handling Precautions:
- Handle with care to avoid static damage; use proper ESD protection practices.
- Avoid mechanical stress on the leads which can affect electrical characteristics.
Mounting:
- Follow recommended mounting procedures to ensure good thermal contact and electrical connections.
- Proper heatsinking is crucial if operating at high power levels or in high ambient temperatures.
Testing:
- When testing the device, adhere to the conditions specified in the parameter table to obtain accurate measurements.
- Use appropriate test equipment and settings to avoid overstressing the device.
Storage:
- Store in a dry, cool place away from direct sunlight and sources of heat to maintain device integrity.
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