Details

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BUY SN74AXC1T45DBVR https://www.utsource.net/itm/p/12606795.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating supply voltage range	1.65	-	3.6	V
Output Voltage (VOH)	High-level output voltage (at IO = -0.1 mA)	-	-	VCC - 0.2	V
Output Voltage (VOL)	Low-level output voltage (at IO = 0.1 mA)	0.2	-	-	V
Input Voltage (VIH)	High-level input voltage	0.7 * VCC	-	-	V
Input Voltage (VIL)	Low-level input voltage	-	-	0.3 * VCC	V
Propagation Delay Time (tpd)	Propagation delay time (CL = 15 pF)	1.9	3.0	4.5	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	380	mW
Operating Temperature Range (TA)	Ambient operating temperature range	-40	-	85	掳C
Storage Temperature Range (TSTG)	Storage temperature range	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (VCC) is within the range of 1.65V to 3.6V.
   • Do not exceed the maximum supply voltage to avoid damaging the device.

2. Output Voltage:

   • The high-level output voltage (VOH) should be at least VCC - 0.2V when the output current (IO) is -0.1 mA.
   • The low-level output voltage (VOL) should be no more than 0.2V when the output current (IO) is 0.1 mA.

3. Input Voltage:

   • The high-level input voltage (VIH) should be at least 0.7 * VCC.
   • The low-level input voltage (VIL) should be no more than 0.3 * VCC.

4. Propagation Delay Time:

   • The propagation delay time (tpd) is measured with a load capacitance (CL) of 15 pF. It ranges from 1.9 ns to 4.5 ns, with a typical value of 3.0 ns.

5. Power Dissipation:

   • The maximum power dissipation (PD) is 380 mW. Ensure that the device does not exceed this limit to prevent overheating and potential damage.

6. Operating Temperature:

   • The ambient operating temperature range (TA) is from -40掳C to 85掳C. Ensure the device operates within this range to maintain reliable performance.

7. Storage Temperature:

   • The storage temperature range (TSTG) is from -65掳C to 150掳C. Store the device in a suitable environment to avoid damage due to extreme temperatures.

8. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Store the device in a dry, cool place away from direct sunlight and sources of heat.

9. Soldering:

   • Follow recommended soldering profiles to ensure proper attachment without causing thermal stress to the device.

10. Testing:

    • Use appropriate test equipment and methods to verify the functionality of the device after installation.

(For reference only)