Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 2 | 6 | V | ||
| Input Low Voltage | VIL | ICC = 0.8 mA | 1.5 | V | ||
| Input High Voltage | VIH | ICC = -0.8 mA | 3.5 | V | ||
| Output Low Voltage | VOL | IO = 4 mA | 0.1 | V | ||
| Output High Voltage | VOH | IO = -4 mA | 4.9 | V | ||
| Leakage Current | IOL | VON, TA = 25掳C | 1 | 渭A | ||
| Propagation Delay Time | tpd | VCC = 5V, TA = 25掳C | 12 | ns | ||
| Power Dissipation | PD | Per Package | 500 | mW |
Instructions for CD54HC4066
Power Supply:
- Ensure the supply voltage (VCC) is within the specified range of 2V to 6V to prevent damage to the device.
Input Signals:
- The input signals should be within the valid logic levels defined by VIL and VIH.
- For reliable operation, keep input voltages within the recommended limits.
Output Handling:
- Outputs can drive loads up to the specified current limits without exceeding the maximum output voltage ratings.
- Ensure that the load resistance allows for proper operation within these limits.
Temperature Considerations:
- The device is designed for operation at ambient temperatures around 25掳C. Operating outside this temperature may affect performance parameters like leakage current and propagation delay.
Handling Electrostatic Discharge (ESD):
- Handle the CD54HC4066 with care as it is sensitive to ESD. Use appropriate handling practices such as anti-static wrist straps and packaging.
Mounting and PCB Layout:
- Ensure proper mounting and PCB layout to minimize noise and interference, which can affect the switching characteristics and reliability of the device.
Propagation Delay:
- For timing-critical applications, account for the propagation delay in your design calculations.
Power Dissipation:
- Monitor the power dissipation to avoid overheating. Ensure adequate heat sinking or cooling if operating near the maximum power dissipation limit.
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