Details
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| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage | Vcc | 2.7 | - | 5.5 | V |
| Operating Temperature | Toper | -40 | - | 85 | 掳C |
| Storage Temperature | Tstg | -65 | - | 150 | 掳C |
| Output Current | Iout | - | 20 | 30 | mA |
| Input Capacitance | Cin | - | 10 | - | pF |
| Output Capacitance | Cout | - | 22 | - | pF |
| Rise Time | tr | - | 10 | - | ns |
| Fall Time | tf | - | 10 | - | ns |
| Propagation Delay Time | tpdl | - | 5 | - | ns |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 2.7V to 5.5V.
- Use appropriate decoupling capacitors close to the power pins to minimize noise.
Temperature Considerations:
- The operating temperature range is from -40掳C to 85掳C.
- The storage temperature range is from -65掳C to 150掳C.
Output Current:
- The typical output current is 20mA, with a maximum of 30mA.
- Do not exceed the maximum output current to avoid damaging the device.
Capacitance:
- The input capacitance (Cin) is typically 10pF.
- The output capacitance (Cout) is typically 22pF.
- Ensure that external capacitors do not significantly exceed these values to maintain performance.
Timing Parameters:
- The rise time (tr) and fall time (tf) are both typically 10ns.
- The propagation delay time (tpdl) is typically 5ns.
- These timing parameters are crucial for high-speed applications.
Handling and Storage:
- Handle the device with care to avoid static damage.
- Store the device in a dry, cool place within the specified storage temperature range.
Mounting and Soldering:
- Follow standard surface mount technology (SMT) procedures for mounting and soldering.
- Ensure that the soldering temperature does not exceed the maximum storage temperature.
Testing:
- Before integrating the device into a circuit, test it under controlled conditions to ensure it meets the specified parameters.
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