IR2101

IR2101


Specifications
SKU
12606847
Details

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Parameter Symbol Min Typical Max Unit Notes
Supply Voltage (High Side) VBH 10 - 20 V -
Supply Voltage (Low Side) VBB 10 - 20 V -
Under-Voltage Lockout (High Side) VUVLOH - 9.5 - V -
Under-Voltage Lockout (Low Side) VUVLOB - 8.0 - V -
Input High Level Voltage VIH 2.0 - 15 V -
Input Low Level Voltage VIL - 0.8 2.0 V -
Output High Level Voltage (High Side) VOH 10 - 20 V -
Output Low Level Voltage (Low Side) VOL - 0.5 2.5 V -
Propagation Delay Time (High to High) td(HH) - 40 - ns -
Propagation Delay Time (Low to Low) td(LL) - 40 - ns -
Propagation Delay Time (High to Low) td(HL) - 65 - ns -
Propagation Delay Time (Low to High) td(LH) - 65 - ns -
Maximum Operating Frequency fMAX - 500 - kHz -
Short-Circuit Current (High Side) ISC_H - 2.0 3.0 A -
Short-Circuit Current (Low Side) ISC_L - 2.0 3.0 A -
Maximum Junction Temperature TJ(MAX) - - 150 掳C -
Storage Temperature Range TSTG -40 - 150 掳C -

Instructions for Use:

  1. Supply Voltages:

    • Ensure that both high-side (VBH) and low-side (VBB) supply voltages are within the specified range (10V to 20V).
    • The under-voltage lockout (UVLO) thresholds are 9.5V for the high side and 8.0V for the low side. If the supply voltage falls below these levels, the device will shut down to protect itself.
  2. Input Signals:

    • The input high level voltage (VIH) should be between 2.0V and 15V.
    • The input low level voltage (VIL) should be between 0.8V and 2.0V.
  3. Output Levels:

    • The output high level voltage (VOH) on the high side is equal to the supply voltage (10V to 20V).
    • The output low level voltage (VOL) on the low side should not exceed 2.5V, with a typical value of 0.5V.
  4. Propagation Delays:

    • The propagation delay times (td(HH), td(LL), td(HL), td(LH)) are typically 40ns for same-level transitions and 65ns for opposite-level transitions.
  5. Operating Frequency:

    • The maximum operating frequency (fMAX) is 500kHz. Ensure that the switching frequency does not exceed this limit.
  6. Short-Circuit Protection:

    • The device can handle short-circuit currents up to 3.0A on both the high side and low side, with a typical value of 2.0A.
  7. Temperature Considerations:

    • The maximum junction temperature (TJ(MAX)) is 150掳C. Ensure proper heat dissipation to prevent overheating.
    • The storage temperature range (TSTG) is from -40掳C to 150掳C. Store the device in a suitable environment to avoid damage.
  8. Layout and PCB Design:

    • Use a well-designed PCB layout to minimize parasitic inductances and capacitances, which can affect performance.
    • Place decoupling capacitors close to the power pins to ensure stable operation.
  9. Testing and Troubleshooting:

    • Test the device under controlled conditions to verify its performance.
    • Monitor the supply voltages, input signals, and output levels to diagnose any issues.

For detailed application notes and further information, refer to the IR2101 datasheet provided by the manufacturer.

(For reference only)

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