Details
BUY 2SJ615-TD-E https://www.utsource.net/itm/p/12606866.html
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCE | - | - | 300 | V | - |
| Emitter-Collector Voltage | VEC | - | - | 300 | V | - |
| Base-Emitter Voltage | VBE | - | - | 7 | V | - |
| Collector Current | IC | - | 15 | - | A | - |
| Base Current | IB | - | 1.5 | - | A | - |
| Power Dissipation | PT | - | - | 180 | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 150 | 掳C | - |
| Storage Temperature | TSTG | -55 | - | 150 | 掳C | - |
| Thermal Resistance (J-C) | R胃JC | - | - | 1.2 | 掳C/W | - |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to maintain junction temperature within specified limits.
- Use recommended mounting torque to avoid mechanical stress.
Biasing:
- Apply base current within the specified range to ensure reliable operation.
- Avoid exceeding maximum collector current ratings.
Operation:
- Operate within the specified voltage and current limits to prevent damage.
- Monitor junction temperature to avoid thermal runaway.
Storage:
- Store in a dry environment within the specified storage temperature range.
- Handle with care to avoid static discharge and physical damage.
Testing:
- Use appropriate test equipment and procedures to verify performance parameters.
- Follow safety guidelines to prevent electrical hazards.
Soldering:
- Use controlled soldering temperatures and times to prevent damage to the device.
- Allow sufficient cooling time after soldering before testing or operation.
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