Details
BUY 2SD1061-R https://www.utsource.net/itm/p/12606892.html
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Collector-Emitter Voltage | Vceo | - | - | 80 | V |
| Emitter-Base Voltage | Vebo | - | - | 5 | V |
| Collector Current | Ic | - | - | 3 | A |
| Base Current | Ib | - | - | 0.3 | A |
| Power Dissipation | Ptot | - | - | 65 | W |
| Junction Temperature | Tj | -40 | - | 150 | 掳C |
| Storage Temperature | Tstg | -55 | - | 150 | 掳C |
| Thermal Resistance | RthJC | - | 2.5 | - | 掳C/W |
Instructions for Use:
Mounting:
- Ensure that the device is mounted on a suitable heat sink to maintain the junction temperature within the specified range.
- Use thermal compound between the device and the heat sink to improve thermal conductivity.
Biasing:
- Apply the base current (Ib) carefully to avoid exceeding the maximum base current rating.
- Ensure that the collector-emitter voltage (Vce) does not exceed 80V to prevent breakdown.
Operating Conditions:
- Operate the device within the specified temperature range to ensure reliable performance.
- Do not exceed the maximum power dissipation (Ptot) of 65W.
Handling:
- Handle the device with care to avoid mechanical damage.
- Use appropriate ESD (Electrostatic Discharge) protection when handling the device to prevent damage from static electricity.
Storage:
- Store the device in a dry, cool place within the storage temperature range of -55掳C to 150掳C.
Testing:
- Test the device under controlled conditions to verify its performance before integrating it into the final application.
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