Details

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BUY ULN2065NE. https://www.utsource.net/itm/p/12606907.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VCC	4.5	-	5.5	V	-
Output Current per Channel	IOUT	-	500	-	mA	-
Continuous Output Current	IC	-	1500	-	mA	-
Peak Output Current	IPEAK	-	3000	-	mA	-
Thermal Shutdown Temperature	TSHUTDOWN	-	175	-	掳C	-
Operating Temperature Range	TOP	-40	-	85	掳C	-
Storage Temperature Range	TSTORAGE	-65	-	150	掳C	-
Input High Voltage	VIH	2.0	-	5.5	V	-
Input Low Voltage	VIL	0	-	0.8	V	-
Input Leakage Current	IIL	-	1	-	渭A	-
Output Leakage Current (High)	IOLH	-	10	-	渭A	-
Output Leakage Current (Low)	IOLL	-	100	-	渭A	-
Propagation Delay Time	tPD	-	500	-	ns	-

Instructions for Using ULN2065NE

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.

2. Output Current:

   • The maximum continuous output current per channel is 500mA, but the device can handle up to 1500mA continuously if the current is distributed across multiple channels.
   • For peak currents, the device can handle up to 3000mA for short durations.

3. Thermal Management:

   • The device will shut down at temperatures around 175掳C to prevent thermal damage.
   • Ensure adequate heat dissipation, especially when operating at high currents or in high ambient temperatures.

4. Operating Temperature:

   • The device is designed to operate between -40掳C and 85掳C. Ensure that the operating environment does not exceed these limits.

5. Storage Temperature:

   • Store the device in a temperature range between -65掳C and 150掳C to maintain its integrity.

6. Input Signals:

   • Input high voltage should be between 2.0V and 5.5V.
   • Input low voltage should be between 0V and 0.8V.
   • Ensure input signals are within these ranges to avoid incorrect operation or damage.

7. Leakage Current:

   • Input leakage current is typically 1渭A, and output leakage currents are 10渭A (high) and 100渭A (low). Design your circuit to account for these values.

8. Propagation Delay:

   • The propagation delay time is typically 500ns. This should be considered in timing-sensitive applications.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Use appropriate ESD protection measures during handling and assembly.

10. Mounting:

    • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
    • Follow the recommended PCB layout guidelines for optimal performance and reliability.

(For reference only)