AT29C256-70JI

AT29C256-70JI


Specifications
Details

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Parameter Description Value
Device Type High Performance CMOS 32K x 8-Bit Flash Memory AT29C256-70JI
Package Type JEDEC SOJ (Shrink Outline J-Lead) SOJ
Supply Voltage VCC Operating Supply Voltage 2.7V to 5.5V
Access Time tACC Access Time at VCC = 5.0V, TA = 25掳C 70ns
Data Retention Data Retention Time 10 years
Endurance Write/Erase Cycle Endurance 100,000 cycles
Temperature Range Operating Temperature Range -40掳C to +85掳C
Programming Voltage Programming Supply Voltage VPP = 12.0V
Chip Enable Active Low Chip Enable Pin CE#
Output Enable Active Low Output Enable Pin OE#
Write Enable Active Low Write Enable Pin WE#
Protection Pin Hardware Write Protect Pin WP#
Organization Memory Organization 32K x 8

Instructions for Use:

  1. Power Supply Connections:

    • Connect VCC to the positive supply voltage (2.7V to 5.5V).
    • Connect GND to the system ground.
  2. Signal Connections:

    • CE# (Chip Enable): Set low to enable the device.
    • OE# (Output Enable): Set low to enable data outputs during read operations.
    • WE# (Write Enable): Set low during write operations.
    • WP# (Write Protect): Set low to allow write operations; high to protect against accidental writes.
  3. Programming:

    • Apply VPP = 12.0V to the programming pin during write operations.
    • Follow the specific timing and sequence requirements for writing data as detailed in the datasheet.
  4. Read Operation:

    • Ensure CE# and OE# are low.
    • Present the address on the address lines.
    • The data will appear on the data lines after the specified access time.
  5. Write Operation:

    • Ensure CE#, WE#, and WP# are properly set.
    • Apply VPP.
    • Follow the protocol for loading the address and data, then execute the write cycle.
  6. Erase Operation:

    • Erase operations typically involve applying specific voltages and following a sequence of commands to erase sectors or the entire chip.
  7. Handling Precautions:

    • Handle with care to avoid static damage.
    • Ensure proper heat sinking if operating at higher temperatures or under heavy load conditions.

Refer to the full datasheet for more detailed information and specific timing diagrams.

(For reference only)

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