Details

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BUY SN75121N. https://www.utsource.net/itm/p/12607000.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	4.5	-	18	V
Output Current (Source)	IO(Source)	-	100	-	mA	Per output channel
Output Current (Sink)	IO(Sink)	-	100	-	mA	Per output channel
Input Current	II	1	5	10	渭A	Typical at VCC = 5V, TA = 25掳C
Quiescent Current	IQ	10	25	40	渭A	Typical at VCC = 5V, TA = 25掳C
Output Low Voltage	VOL	0.4	-	0.9	V	At IO = 100mA, VCC = 5V
Output High Voltage	VOH	3.6	-	4.5	V	At IO = -100mA, VCC = 5V
Propagation Delay Time	tpd	15	25	35	ns	Typical at VCC = 5V, TA = 25掳C
Operating Temperature	TA	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (V_CC) is within the range of 4.5V to 18V. The device is designed to operate reliably within this range.

2. Output Current:

   • The device can source or sink up to 100mA per output channel. Do not exceed this limit to avoid damage to the IC.

3. Input Current:

   • The input current (I_I) is typically between 1渭A and 10渭A. Ensure that the driving circuitry can handle these currents.

4. Quiescent Current:

   • The quiescent current (I_Q) is typically around 25渭A at 5V supply voltage and 25掳C ambient temperature. This should be considered in low-power applications.

5. Output Voltage Levels:

   • When the output is low (V_OL), it will be between 0.4V and 0.9V when sourcing 100mA.
   • When the output is high (V_OH), it will be between 3.6V and 4.5V when sinking 100mA.

6. Propagation Delay:

   • The propagation delay time (t_pd) is typically around 25ns at 5V supply voltage and 25掳C ambient temperature. This is important for timing considerations in your design.

7. Operating and Storage Temperature:

   • The device can operate within a temperature range of -40掳C to 85掳C. For storage, the temperature range is -65掳C to 150掳C.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the IC. Use appropriate ESD protection measures.

9. Mounting:

   • Ensure proper mounting and soldering techniques to avoid thermal stress and mechanical damage. Follow the recommended PCB layout guidelines provided by the manufacturer.

10. Testing:

    • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications and performance criteria.

(For reference only)