IN4448

IN4448


Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Forward Voltage V_F IF = 1mA - 1.0 1.2 V
Reverse Breakdown Voltage V_R IR = 5渭A 75 - 100 V
Forward Current (Non-repetitive) I_FM T = 25掳C, t = 8.3ms - 1000 - mA
Maximum Reverse Current I_R VR = 100V, T = 25掳C - 5 50 渭A
Junction Temperature T_J - - 150 掳C
Storage Temperature T_STG -65 - 150 掳C

Instructions for IN4448:

  1. Handling and Storage:

    • Store the device in a dry, cool place.
    • Avoid exposing the device to high humidity or corrosive environments.
  2. Mounting and Soldering:

    • Ensure that the soldering temperature does not exceed 260掳C.
    • The duration of soldering should be limited to 10 seconds per operation.
    • Allow adequate cooling time after soldering to prevent thermal shock.
  3. Electrical Handling:

    • Do not exceed the maximum reverse voltage rating to avoid breakdown.
    • Operate within the specified forward current limits to prevent damage.
    • Be cautious with the junction temperature; do not exceed 150掳C.
  4. Testing:

    • Use appropriate test equipment to ensure accurate readings.
    • During testing, keep within the operational limits specified in the parameter table.
  5. Application Considerations:

    • The IN4448 is suitable for rectification and switching applications.
    • Ensure proper heat sinking if operating at higher currents or temperatures.
(For reference only)

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