Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | V_F | IF = 1mA | - | 1.0 | 1.2 | V |
| Reverse Breakdown Voltage | V_R | IR = 5渭A | 75 | - | 100 | V |
| Forward Current (Non-repetitive) | I_FM | T = 25掳C, t = 8.3ms | - | 1000 | - | mA |
| Maximum Reverse Current | I_R | VR = 100V, T = 25掳C | - | 5 | 50 | 渭A |
| Junction Temperature | T_J | - | - | 150 | 掳C | |
| Storage Temperature | T_STG | -65 | - | 150 | 掳C |
Instructions for IN4448:
Handling and Storage:
- Store the device in a dry, cool place.
- Avoid exposing the device to high humidity or corrosive environments.
Mounting and Soldering:
- Ensure that the soldering temperature does not exceed 260掳C.
- The duration of soldering should be limited to 10 seconds per operation.
- Allow adequate cooling time after soldering to prevent thermal shock.
Electrical Handling:
- Do not exceed the maximum reverse voltage rating to avoid breakdown.
- Operate within the specified forward current limits to prevent damage.
- Be cautious with the junction temperature; do not exceed 150掳C.
Testing:
- Use appropriate test equipment to ensure accurate readings.
- During testing, keep within the operational limits specified in the parameter table.
Application Considerations:
- The IN4448 is suitable for rectification and switching applications.
- Ensure proper heat sinking if operating at higher currents or temperatures.
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