TC74VHC14FK

TC74VHC14FK


Specifications
SKU
12607048
Details

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Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 2.0 - 5.5 V
Input Low Voltage VIL - - 1.5 V VCC = 5.5V
Input High Voltage VIH 3.5 - - V VCC = 5.5V
Output Low Voltage VOL 0.0 - 0.4 V IOL = 8 mA, VCC = 5.5V
Output High Voltage VOH 4.5 - - V IOH = -4 mA, VCC = 5.5V
Propagation Delay Time tpd - 9 - ns VCC = 5.5V, TA = 25掳C
Power Consumption ICC - 1 - 渭A VCC = 5.5V, No Load
Operating Temperature TA -40 - 85 掳C
Storage Temperature TSTG -65 - 150 掳C

Instructions for Use:

  1. Supply Voltage (VCC):

    • The device operates within a supply voltage range of 2.0V to 5.5V. Ensure that the power supply is stable and within this range to avoid damage or malfunction.
  2. Input Voltage Levels:

    • For proper operation, the input low voltage (VIL) should be less than or equal to 1.5V when VCC is 5.5V.
    • The input high voltage (VIH) should be greater than or equal to 3.5V when VCC is 5.5V.
  3. Output Voltage Levels:

    • When the output is low (VOL), it should not exceed 0.4V under a load current of 8mA.
    • When the output is high (VOH), it should be at least 4.5V under a load current of -4mA.
  4. Propagation Delay Time (tpd):

    • The typical propagation delay time is 9 nanoseconds at a supply voltage of 5.5V and an ambient temperature of 25掳C. This is the time it takes for the output to respond to a change in the input.
  5. Power Consumption (ICC):

    • The typical power consumption is 1 microampere at 5.5V with no load. Ensure that the power supply can handle this current draw.
  6. Operating Temperature (TA):

    • The device is designed to operate within a temperature range of -40掳C to 85掳C. Avoid operating outside this range to prevent damage.
  7. Storage Temperature (TSTG):

    • The device can be stored in temperatures ranging from -65掳C to 150掳C. However, prolonged exposure to extreme temperatures may affect performance.
  8. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits. Store in a dry, cool place to maintain optimal performance.
  9. Mounting and Soldering:

    • Follow standard soldering practices to ensure reliable connections. Avoid excessive heat during soldering as it can damage the device.
  10. Testing and Verification:

    • After mounting, verify the functionality of the device by testing its input and output signals. Ensure that the supply voltage and signal levels are within the specified ranges.
(For reference only)

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