Details

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BUY TC74AC14F(EL.F) https://www.utsource.net/itm/p/12607126.html

Parameter	Symbol	Min	Typical	Max	Unit	Condition
Supply Voltage	VCC	2.0	-	6.0	V	-
Input Low Voltage	VIL	-	-	1.5	V	VCC = 5V
Input High Voltage	VIH	3.5	-	-	V	VCC = 5V
Output Low Voltage	VOL	0.4	-	0.8	V	IOL = 16mA, VCC = 5V
Output High Voltage	VOH	4.2	-	4.5	V	IOH = -4mA, VCC = 5V
Propagation Delay Time (Low to High)	tPLH	9	-	22	ns	VCC = 5V, TA = 25掳C
Propagation Delay Time (High to Low)	tPHL	9	-	22	ns	VCC = 5V, TA = 25掳C
Power Dissipation	PD	-	-	360	mW	TA = 25掳C
Operating Temperature Range	TA	-40	-	85	掳C	-
Storage Temperature Range	TSTG	-65	-	150	掳C	-

Instructions for Use:

1. Power Supply:

   • The device operates with a supply voltage (V_CC) ranging from 2.0V to 6.0V. Ensure that the power supply is stable and within this range to avoid damage to the device.

2. Input Levels:

   • For reliable operation, ensure that the input voltages (V_IL and V_IH) are within the specified ranges. V_IL should be less than or equal to 1.5V, and V_IH should be greater than or equal to 3.5V when V_CC is 5V.

3. Output Levels:

   • The output low voltage (V_OL) should not exceed 0.8V when sourcing 16mA, and the output high voltage (V_OH) should be at least 4.2V when sinking -4mA, both at V_CC = 5V.

4. Propagation Delay:

   • The propagation delay times (t_PLH and t_PHL) are crucial for timing considerations. Both delays are typically around 9ns to 22ns at V_CC = 5V and ambient temperature (T_A) = 25掳C.

5. Power Dissipation:

   • The maximum power dissipation (P_D) is 360mW at T_A = 25掳C. Ensure proper heat dissipation if operating near this limit.

6. Temperature Ranges:

   • The device is designed to operate within an ambient temperature range of -40掳C to 85掳C. The storage temperature range is -65掳C to 150掳C, allowing for safe handling and storage outside of operational conditions.

7. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits. Use appropriate ESD protection measures during handling and assembly.

8. Mounting and Soldering:

   • Follow recommended soldering profiles to ensure reliable connections. Avoid excessive heat and mechanical stress during the mounting process.

By adhering to these parameters and instructions, you can ensure optimal performance and longevity of the TC74AC14F(EL.F) device.

(For reference only)