Details

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BUY FGH60T65SHD-F155 https://www.utsource.net/itm/p/12607131.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Voltage Rating (Drain to Source)	VDS	-	650	-	V	Maximum voltage between drain and source with gate open
Continuous Drain Current	ID	-	60	-	A	Continuous current flowing from drain to source at 25掳C case temperature
Power Dissipation	PD	-	300	-	W	Maximum power dissipation at 25掳C ambient temperature
Gate-Source Voltage	VGS	-10	0	20	V	Maximum voltage between gate and source
Gate Charge	QG	-	155	-	nC	Total gate charge
Input Capacitance	Ciss	-	4500	-	pF	Input capacitance at VDS = 400V, VGS = 0V
Output Capacitance	Coss	-	1200	-	pF	Output capacitance at VDS = 400V, VGS = 0V
Reverse Transfer Capacitance	Crss	-	1100	-	pF	Reverse transfer capacitance at VDS = 400V, VGS = 0V
Turn-On Delay Time	td(on)	-	45	-	ns	Time from 10% of VGS to 10% of ID
Rise Time	tr	-	40	-	ns	Time from 10% to 90% of ID
Turn-Off Delay Time	td(off)	-	55	-	ns	Time from 90% of VGS to 90% of ID
Fall Time	tf	-	45	-	ns	Time from 90% to 10% of ID
Junction Temperature	TJ	-55	-	175	掳C	Operating junction temperature range
Storage Temperature	Tstg	-55	-	150	掳C	Storage temperature range

Instructions for Use:

1. Handling Precautions:

   • Avoid exposing the device to excessive mechanical stress.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure good thermal contact between the device and the heat sink.
   • Use a suitable thermal compound to enhance heat dissipation.

3. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Operate within the recommended operating conditions to ensure reliable performance.

4. Gate Drive:

   • Use a gate resistor to control the switching speed and reduce ringing.
   • Ensure the gate drive circuit can provide sufficient current to charge and discharge the gate capacitance quickly.

5. Thermal Management:

   • Monitor the junction temperature to prevent overheating.
   • Use forced air cooling or a heatsink if necessary to maintain the device within its thermal limits.

6. Storage:

   • Store the device in a dry, cool place away from direct sunlight and corrosive substances.
   • Follow the recommended storage temperature range to avoid damage.

7. Testing:

   • Use appropriate test equipment and methods to verify the device parameters.
   • Ensure that the test conditions match the specifications provided in the datasheet.

8. Soldering:

   • Follow the recommended soldering profile to avoid thermal shock and damage to the device.
   • Use a controlled soldering process to ensure reliable connections.

(For reference only)