Details

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BUY IGCM20F60GA/20A600V https://www.utsource.net/itm/p/12607152.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Rated Voltage	VDS	-	600	-	V	-
Continuous Drain Current (TC=25掳C)	ID	-	20	-	A	-
Continuous Drain Current (TC=100掳C)	ID	-	14	-	A	-
Pulse Drain Current (10ms, 1% Duty Cycle)	ID(p)	-	80	-	A	-
Gate-Source Voltage	VGS	-20	-	20	V	-
Gate Threshold Voltage	VGS(th)	2.0	3.5	4.5	V	ID=250渭A, TJ=25掳C
On-State Resistance at 25掳C	RDS(on)	-	0.18	-	惟	VGS=10V, ID=20A
On-State Resistance at 100掳C	RDS(on)	-	0.25	-	惟	VGS=10V, ID=14A
Total Gate Charge	QG	-	70	-	nC	-
Input Capacitance	Ciss	-	1500	-	pF	VDS=600V, f=1MHz
Output Capacitance	Coss	-	220	-	pF	VDS=600V, f=1MHz
Reverse Transfer Capacitance	Crss	-	200	-	pF	VDS=600V, f=1MHz
Junction-to-Case Thermal Resistance	R胃JC	-	0.5	-	掳C/W	-
Junction-to-Ambient Thermal Resistance	R胃JA	-	62	-	掳C/W	-
Maximum Junction Temperature	TJ(max)	-	-	175	掳C	-
Storage Temperature Range	Tstg	-55	-	150	掳C	-

Instructions for Use:

1. Operating Conditions:

   • Ensure that the drain-source voltage ( V_ ) does not exceed 600V.
   • The continuous drain current ( I_D ) should not exceed 20A at 25掳C and 14A at 100掳C.
   • The pulse drain current ( I_D(p) ) can reach up to 80A for a 10ms duration with a 1% duty cycle.

2. Gate Drive:

   • The gate-source voltage ( V_ ) should be within the range of -20V to +20V.
   • The gate threshold voltage ( V_{GS(th)} ) is typically between 2.0V and 4.5V at 25掳C.

3. Thermal Management:

   • The junction-to-case thermal resistance ( R_{theta JC} ) is 0.5掳C/W, and the junction-to-ambient thermal resistance ( R_{theta JA} ) is 62掳C/W.
   • The maximum junction temperature ( T_J ) should not exceed 175掳C.
   • Ensure proper heat sinking to manage the thermal resistance and keep the junction temperature within safe limits.

4. Capacitance Considerations:

   • The input capacitance ( C_ ) is 1500pF, the output capacitance ( C_ ) is 220pF, and the reverse transfer capacitance ( C_ ) is 200pF. These values are important for designing the gate drive circuit and calculating switching losses.

5. Storage and Handling:

   • Store the device in a dry, cool place within the storage temperature range of -55掳C to 150掳C.
   • Handle the device with care to avoid static discharge, which can damage the sensitive components.

6. Mounting:

   • Ensure that the device is securely mounted to the PCB or heatsink to prevent mechanical stress and ensure good thermal contact.
   • Follow the recommended soldering profile and avoid excessive heat during soldering to prevent damage to the device.

(For reference only)