Details

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BUY GM71C17803CJ6 https://www.utsource.net/itm/p/12607157.html

Parameter	Description	Value	Unit
Device Type		17803CJ6
Manufacturer		GM71
Package Type		TSSOP-24
Operating Voltage (Vcc)	Supply Voltage Range	2.7 to 5.5	V
Operating Temperature (Tamb)	Ambient Operating Temperature Range	-40 to +85	掳C
Storage Temperature (Tstg)	Storage Temperature Range	-65 to +150	掳C
Input Voltage (VIH)	High-Level Input Voltage	2.0 to 5.5	V
Input Voltage (VIL)	Low-Level Input Voltage	0 to 0.8	V
Output Voltage (VOH)	High-Level Output Voltage	2.4 to Vcc	V
Output Voltage (VOL)	Low-Level Output Voltage	0 to 0.4	V
Input Current (IIH)	High-Level Input Current	-1	渭A
Input Current (IIL)	Low-Level Input Current	1	渭A
Output Current (IOH)	High-Level Output Current	-4	mA
Output Current (IOL)	Low-Level Output Current	16	mA
Propagation Delay Time (tpd)	Propagation Delay Time	12	ns
Power Consumption (ICC)	Active Current	10	渭A
Standby Current (ISB)	Standby Current	1	渭A

Instructions:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V.
   • Use a stable power source to avoid fluctuations that could affect device performance.

2. Temperature Considerations:

   • The device can operate in ambient temperatures ranging from -40掳C to +85掳C.
   • Store the device in temperatures between -65掳C and +150掳C.

3. Input and Output Levels:

   • Ensure input voltages (VIH and VIL) are within the specified ranges to prevent damage or incorrect operation.
   • Output voltages (VOH and VOL) should also be within the specified limits to ensure proper signal integrity.

4. Current Ratings:

   • Do not exceed the maximum input and output current ratings to avoid damaging the device.
   • The device has low active and standby currents, making it suitable for low-power applications.

5. Propagation Delay:

   • The propagation delay time (tpd) is 12 nanoseconds, which is important for timing considerations in your circuit design.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.

7. Mounting:

   • Use appropriate soldering techniques and temperatures to ensure reliable connections.
   • Ensure the TSSOP-24 package is properly aligned and soldered to the PCB to avoid short circuits or open connections.

8. Testing:

   • After installation, test the device under normal operating conditions to verify its functionality.
   • Use a multimeter or oscilloscope to check input and output voltages and currents.

(For reference only)