Details

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BUY UPC2710T-E3 https://www.utsource.net/itm/p/12607170.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	Vcc	Operating	4.5	5.0	5.5	V
Output Current	Iout	Continuous	-	200	-	mA
Quiescent Current	Iq	Vcc = 5V	-	1.5	-	mA
Dropout Voltage	Vdo	Iout = 100mA	-	0.5	-	V
Line Regulation	ΔVout/ΔVin	Iout = 100mA	-	0.01	-	%
Load Regulation	ΔVout/ΔIout	Vin = 5V	-	0.02	-	%
Ripple Rejection	PSRR	f = 1kHz	-	60	-	dB
Operating Temperature	Toper	Storage	-40	-	85	°C
Storage Temperature	Tstg		-65	-	150	°C

Instructions for Use

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.

2. Output Current (Iout):

   • The device can provide up to 200mA of continuous output current. Exceeding this limit may cause overheating or damage.

3. Quiescent Current (Iq):

   • The quiescent current is typically 1.5mA at a supply voltage of 5V. This should be considered in low-power applications.

4. Dropout Voltage (Vdo):

   • The dropout voltage is typically 0.5V when the output current is 100mA. Ensure the input voltage is at least 0.5V higher than the desired output voltage.

5. Line Regulation:

   • The line regulation is typically 0.01% when the output current is 100mA. This indicates the stability of the output voltage with respect to changes in input voltage.

6. Load Regulation:

   • The load regulation is typically 0.02% when the input voltage is 5V. This indicates the stability of the output voltage with respect to changes in load current.

7. Ripple Rejection (PSRR):

   • The power supply rejection ratio (PSRR) is typically 60dB at a frequency of 1kHz. This helps in filtering out ripple from the input supply.

8. Operating Temperature (Toper):

   • The device is designed to operate within a temperature range of -40°C to 85°C. Ensure the ambient temperature does not exceed these limits.

9. Storage Temperature (Tstg):

   • The device can be stored in temperatures ranging from -65°C to 150°C. However, prolonged exposure to extreme temperatures may affect performance.

10. Mounting and Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow standard PCB mounting procedures to ensure proper soldering and connection.

11. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications.

12. Applications:

    • Suitable for use in low-voltage, low-current applications such as microcontrollers, sensors, and other small electronics.

(For reference only)