Details
BUY MC145406N https://www.utsource.net/itm/p/12607193.html
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | 4.5 | 5.0 | 5.5 | V | |
| Output Current per Channel | Iout | - | 20 | 35 | mA | |
| Maximum Power Dissipation | Pdiss | - | - | 700 | mW | |
| Operating Temperature Range | Toper | -40 | - | 85 | 掳C | |
| Storage Temperature Range | Tstg | -65 | - | 150 | 掳C | |
| Input Voltage Range | Vin | 0 | - | Vcc | V | |
| Low-Level Input Voltage | VIL | 0 | - | 0.8 | V | |
| High-Level Input Voltage | VIH | 2.0 | - | Vcc | V | |
| Low-Level Output Voltage | VOL | 0 | 0.4 | 0.7 | V @ 20mA | |
| High-Level Output Voltage | VOH | 2.4 | 4.5 | Vcc | V @ 20mA | |
| Propagation Delay Time (Typ) | tpd | - | 10 | - | ns |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V to avoid damage to the device.
Output Current:
- Each output channel can source or sink up to 35mA. For reliable operation, limit the current to 20mA per channel.
Power Dissipation:
- The maximum power dissipation is 700mW. Ensure proper heat sinking if operating near this limit.
Temperature Ranges:
- The operating temperature range is from -40掳C to 85掳C.
- The storage temperature range is from -65掳C to 150掳C.
Input Voltage:
- Input voltages should be within the range of 0V to Vcc to prevent damage.
Input Logic Levels:
- Low-level input voltage (VIL) should be less than 0.8V.
- High-level input voltage (VIH) should be greater than 2.0V but less than Vcc.
Output Logic Levels:
- Low-level output voltage (VOL) should not exceed 0.7V at 20mA.
- High-level output voltage (VOH) should be at least 2.4V at 20mA and can go up to Vcc.
Propagation Delay:
- The typical propagation delay time (tpd) is 10ns. This is the time it takes for the output to respond to a change in the input.
Handling:
- Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
Mounting:
- Ensure the device is securely mounted on the PCB to prevent mechanical stress and ensure good thermal performance.
Testing:
- Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters.
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