MC145406N

MC145406N


Specifications
SKU
12607193
Details

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Parameter Symbol Min Typ Max Unit Notes
Supply Voltage Vcc 4.5 5.0 5.5 V
Output Current per Channel Iout - 20 35 mA
Maximum Power Dissipation Pdiss - - 700 mW
Operating Temperature Range Toper -40 - 85 掳C
Storage Temperature Range Tstg -65 - 150 掳C
Input Voltage Range Vin 0 - Vcc V
Low-Level Input Voltage VIL 0 - 0.8 V
High-Level Input Voltage VIH 2.0 - Vcc V
Low-Level Output Voltage VOL 0 0.4 0.7 V @ 20mA
High-Level Output Voltage VOH 2.4 4.5 Vcc V @ 20mA
Propagation Delay Time (Typ) tpd - 10 - ns

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Current:

    • Each output channel can source or sink up to 35mA. For reliable operation, limit the current to 20mA per channel.
  3. Power Dissipation:

    • The maximum power dissipation is 700mW. Ensure proper heat sinking if operating near this limit.
  4. Temperature Ranges:

    • The operating temperature range is from -40掳C to 85掳C.
    • The storage temperature range is from -65掳C to 150掳C.
  5. Input Voltage:

    • Input voltages should be within the range of 0V to Vcc to prevent damage.
  6. Input Logic Levels:

    • Low-level input voltage (VIL) should be less than 0.8V.
    • High-level input voltage (VIH) should be greater than 2.0V but less than Vcc.
  7. Output Logic Levels:

    • Low-level output voltage (VOL) should not exceed 0.7V at 20mA.
    • High-level output voltage (VOH) should be at least 2.4V at 20mA and can go up to Vcc.
  8. Propagation Delay:

    • The typical propagation delay time (tpd) is 10ns. This is the time it takes for the output to respond to a change in the input.
  9. Handling:

    • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
  10. Mounting:

    • Ensure the device is securely mounted on the PCB to prevent mechanical stress and ensure good thermal performance.
  11. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters.
(For reference only)

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